Housing and Terminal profile guarantees support of up to 12Gb/s

Vertical versus vertical mating configuration

40 to 200 position sizes in 20 position increments

5 mm to 20 mm stack heights in 1 mm increments

Housing and Terminal profile guarantees support of up to 12Gb/s

Vertical versus vertical mating configuration

40 to 200 position sizes in 20 position increments

5 mm to 20 mm stack heights in 1 mm increments

0.8 mm double-row contact pitch conserves printed circuit board space

Scoop-proof feature housings

Multiple plating options available

Multiple packaging options available

PCB locator pegs option

Lead-free

Compatible with PCIe Gen 2/3 and SAS 3.0 high speed performance on selected stack heights

Suitable for parallel board stacking applications

Comprehensive range of sizes and stack heights to satisfy all needs

High density for all electrical applications needs

Prevents reverse mating

Satisfies different application requirement

Suitable for varies feeding processing

Facilitates ease and accuracy during manual assembly

BergStak® 0.80 mm Pitch, Mezzanine Connector, Vertical Header, Double Row, 40 Positions.

모두 선택	제품 정보	값
	브랜드	Amphenol Communications Solutions
	Series	BergStak
	Product Type	PCB Header
	Pitch	0.8mm
	Number of Contacts	40
	Number of Rows	2
	Shrouded/Unshrouded	Shrouded
	Connector System	Board-to-Board
	Contact Plating	Gold
	Contact Material	Brass

	모두 선택
	브랜드 Amphenol Communications Solutions
	Series BergStak
	Product Type PCB Header
	Pitch 0.8mm
	Number of Contacts 40
	Number of Rows 2
	Shrouded/Unshrouded Shrouded
	Connector System Board-to-Board
	Contact Plating Gold
	Contact Material Brass

Amphenol Communications Solutions BergStak Series PCB Header, 40 Contact(s), 0.8 mm Pitch, 2 Row, Shrouded

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