Molex 70280 Series Vertical PCB PCB Header, 11 Contact(s), 2.54 mm Pitch, 1 Row, Unshrouded
- RS 제품 번호:
- 815-438
- 제조사 부품 번호:
- 10-97-7106
- 제조업체:
- Molex
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- RS 제품 번호:
- 815-438
- 제조사 부품 번호:
- 10-97-7106
- 제조업체:
- Molex
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Product Type | PCB Header | |
| Series | 70280 | |
| Pitch | 2.54mm | |
| Current | 3A | |
| Housing Material | Thermoplastic | |
| Number of Contacts | 11 | |
| Number of Rows | 1 | |
| Orientation | Vertical | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | PCB | |
| Connector System | Board-to-Board, Wire-to-Board | |
| Contact Material | Copper Alloy | |
| Contact Plating | Tin | |
| Termination Type | Through Hole | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| Tail Pin Length | 2.79mm | |
| Contact Gender | Male | |
| Standards/Approvals | UL | |
| Voltage | 250V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Product Type PCB Header | ||
Series 70280 | ||
Pitch 2.54mm | ||
Current 3A | ||
Housing Material Thermoplastic | ||
Number of Contacts 11 | ||
Number of Rows 1 | ||
Orientation Vertical | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type PCB | ||
Connector System Board-to-Board, Wire-to-Board | ||
Contact Material Copper Alloy | ||
Contact Plating Tin | ||
Termination Type Through Hole | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
Tail Pin Length 2.79mm | ||
Contact Gender Male | ||
Standards/Approvals UL | ||
Voltage 250V | ||
- COO (Country of Origin):
- MY
The Molex C-Grid Breakaway Header designed for efficient high-temperature applications with dual rows for flexible connectivity. This component supports 10 circuits and is optimised for reliability in demanding environments.
Active status ensuring availability for current projects
High-temperature thermoplastic resin provides durability under extreme conditions
Copper alloy metal construction ensures reliable electrical conductivity
Lead-free solder process capability for environmentally responsible manufacturing
Compact size optimised for board-to-board and wire-to-board applications
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