Infineon BSZ N-Channel MOSFET, 40 A, 30 V N, 8-Pin TSDSON BSZ0506NSATMA1

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  • 2027년 11월 04일 부터 배송
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RS 제품 번호:
260-5078
제조사 부품 번호:
BSZ0506NSATMA1
제조업체:
Infineon
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모두 선택

브랜드

Infineon

Product Type

MOSFET

Channel Type

N

Maximum Continuous Drain Current Id

40A

Maximum Drain Source Voltage Vds

30V

Package Type

TSDSON

Series

BSZ

Pin Count

8

Maximum Drain Source Resistance Rds

5.30mΩ

Channel Mode

N

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

+150°C

Standards/Approvals

RoHS

Automotive Standard

No

Infineon BSZ Series MOSFET, 30V Maximum Drain-Source Voltage, 40A Maximum Continuous Drain Current - BSZ0506NSATMA1


This MOSFET is an N-channel, surface-mount transistor designed for power switching and management in Compact assemblies. It operates across a wide temperature span and meets RoHS restrictions, making it suitable for environments that demand consistent electrical performance and environmental compliance.

Features and Benefits:


• 5.30mΩ Rds(on) for reduced conduction losses
• 40A continuous drain current for high-current operation
• 30V drain-source rating for medium-voltage circuits
• TSDSON package enabling Compact surface-mount integration
• -55°C to +150°C operating range for thermal resilience

Applications


• Suitable for DC-DC converter output stages
• Ideal for high-current power distribution modules
• Used with motor-driver circuits requiring low-loss switches
• Can be used for synchronous rectification in power supplies
• Suitable for Compact surface-mount power assemblies

What pin count does the device provide for PCB layout considerations?


It uses an 8‑pin arrangement to support thermal and electrical routing.

Which channel polarity does it employ for switching topology?


The device is an N‑channel type suited to low‑side or synchronous switching.

Is this component intended for automotive qualification?


It is not specified as meeting automotive standards.

What environmental directive compliance is included?


It conforms to RoHS requirements.

What package style aids thermal performance on small boards?


The TSDSON package offers a surface-mount form factor that assists heat dissipation.

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