Vishay E Type N-Channel Power MOSFET, 29 A, 600 V, 8-Pin PowerPAK 10 x 12 SIHK075N60E-T1-GE3

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₩14,469,000.00

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  • 2026년 6월 29일 부터 2,000 개 단위 배송
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2000 - 8000₩7,234.50₩14,467,830.00
10000 +₩7,016.10₩14,033,760.00

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RS 제품 번호:
239-5380
제조사 부품 번호:
SIHK075N60E-T1-GE3
제조업체:
Vishay
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모두 선택

브랜드

Vishay

Product Type

Power MOSFET

Channel Type

Type N

Maximum Continuous Drain Current Id

29A

Maximum Drain Source Voltage Vds

600V

Series

E

Package Type

PowerPAK 10 x 12

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

0.08Ω

Forward Voltage Vf

1.2V

Maximum Power Dissipation Pd

167W

Typical Gate Charge Qg @ Vgs

41nC

Maximum Gate Source Voltage Vgs

30V

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

150°C

Standards/Approvals

RoHS

Automotive Standard

No

Vishay Series E Power MOSFET, 600V Drain Source Voltage, 29A Maximum Continuous Drain Current - SIHK075N60E-T1-GE3


This power MOSFET is a high-voltage switching transistor designed for demanding electronic and electrical systems. It operates as an N-channel device suitable for surface-mount implementations, offering high-temperature endurance and substantial continuous current capability for power conversion and switching tasks in industrial environments.

Features and Benefits:


• 600V rating enables high-voltage switching applications • 29A continuous current supports heavy-load operation • 0.08Ω low Rds(on) reduces conduction losses • 167W power dissipation allows sustained thermal load handling • 41nC typical gate charge facilitates Faster switching transitions • 150°C maximum operating temperature permits elevated-temperature use

Applications


• Suitable for inverter stages in industrial drives • Ideal for switch-mode power supplies in automation systems • Used for high-voltage motor control circuits • Can be used for power conversion in renewable-energy inverters • Suitable for solid-state switching in electrical distribution equipment

What gate-drive considerations should I account for in designs?


Drive circuitry must handle a maximum gate-to-source voltage of 30V and be able to source/sink current to charge the typical 41nC gate quickly for efficient switching.

How should thermal management be approached for prolonged operation?


Ensure adequate PCB thermal layout and heat-sinking to dissipate up to 167W, and consider the device’s 150°C maximum junction rating when specifying cooling.

What are the electrical limits for safe operation at low temperatures?


The device is specified for use down to -55°C, so components and soldering processes must accommodate this minimum ambient without exceeding electrical stress limits.

Which package characteristics affect PCB assembly and layout?


The component uses an 8-pin PowerPAK 10x12 surface-mount package, requiring appropriate land pattern and solder paste deposition for reliable mounting and thermal transfer.

Is this suitable for automotive-grade replacements?


It is not specified to meet automotive standardisation, so suitability should be verified against vehicle-specific qualification requirements.

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