Infineon IPB64N25S3-20 N-Channel MOSFET, 64 A, 250 V Enhancement, 3-Pin TO-263 IPB64N25S320ATMA1

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  • 2027년 2월 03일 부터 배송
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RS 제품 번호:
170-2295
제조사 부품 번호:
IPB64N25S320ATMA1
제조업체:
Infineon
제품 정보를 선택해 유사 제품을 찾기
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브랜드

Infineon

Product Type

MOSFET

Channel Type

N

Maximum Continuous Drain Current Id

64A

Maximum Drain Source Voltage Vds

250V

Series

IPB64N25S3-20

Package Type

TO-263

Mount Type

Surface

Pin Count

3

Maximum Drain Source Resistance Rds

20mΩ

Channel Mode

Enhancement

Maximum Gate Source Voltage Vgs

20V

Forward Voltage Vf

1V

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

300W

Typical Gate Charge Qg @ Vgs

67nC

Maximum Operating Temperature

175°C

Length

10mm

Height

4.4mm

Width

10.25mm

Standards/Approvals

No

Automotive Standard

AEC

Infineon IPB64N25S3-20 Series MOSFET, 250V Maximum Drain Source Voltage, 64A Maximum Continuous Drain Current - IPB64N25S320ATMA1


This MOSFET is a high-voltage N-channel semiconductor device designed for switching and power-conversion roles in demanding electronic systems. It operates across a very wide temperature span and is built for surface-mount deployment in a TO-263 package, making it suitable for compact assemblies where robust power handling is required.

Features and Benefits:


• 250V drain rating enables high-voltage switching capability
• 64A continuous drain current supports heavy current loads
• 20mΩ Rds(on) minimises conduction losses during operation
• 300W power dissipation allows sustained thermal loading
• 67nC typical gate charge ensures predictable switching behaviour
• 20V gate voltage rating maintains safe gate-drive margins

Applications


• Ideal for automotive power-conversion modules
• Suitable for high-current DC-DC converters
• Used with motor-drive inverter stages
• Can be used for server and telecoms power supplies
• Suitable for high-temperature industrial electronics

What thermal range can this device tolerate in harsh environments?


It functions across -55°C to 175°C ambient endpoints, allowing use in extreme-temperature applications and reducing the need for extensive thermal protection.

How does the package influence PCB assembly and cooling?


The TO-263 surface-mount form factor provides a low-profile mounting option and presents a large thermal pad for heat transfer to heatsinks or copper pours on the PCB.

What gate-drive considerations are required for reliable switching?


A gate-source rating of 20V sets the maximum permissible gate drive

designers should select gate voltages within this limit and account for the 67nC gate charge when sizing drivers.

How does the device type affect circuit topology choices?


As an enhancement-mode N-channel MOSFET, it needs a positive gate drive relative to the source for conduction, making it appropriate for low-side switching and synchronous rectification arrangements.

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