Infineon OptiMOS Type N-Channel MOSFET, 46 A, 60 V Enhancement, 8-Pin TDSON

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  • 2027년 1월 14일 부터 배송
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RS 제품 번호:
166-1198
제조사 부품 번호:
BSC097N06NSATMA1
제조업체:
Infineon
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

Infineon

Channel Type

Type N

Product Type

MOSFET

Maximum Continuous Drain Current Id

46A

Maximum Drain Source Voltage Vds

60V

Series

OptiMOS

Package Type

TDSON

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

14.6mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

36W

Typical Gate Charge Qg @ Vgs

12nC

Forward Voltage Vf

1.2V

Maximum Operating Temperature

150°C

Height

1.1mm

Standards/Approvals

No

Length

5.35mm

Automotive Standard

No

해당 안됨

COO (Country of Origin):
MY

Infineon OptiMOS Series MOSFET, 60V Drain Source Voltage, 46A Continuous Drain Current - BSC097N06NSATMA1


This MOSFET is a power transistor designed for switching and amplification in high-current, low-voltage circuits. It operates across an extended temperature span and is supplied in a compact surface-mount package suitable for dense board layouts. The device is intended for demanding electronic assemblies where efficient conduction and gate control are required.

Features and Benefits:


• Maximum drain-source voltage 60V enables robust low-voltage switching
• Continuous drain current 46A supports high-current load handling
• Low RDS(on) 14.6 mΩ reduces conduction losses in power paths
• Maximum power dissipation 36W allows sustained thermal loading
• Typical gate charge 12 nC provides swift gate transitions
• Gate-source tolerance 20V permits flexible drive voltages

Applications


• Suitable for synchronous buck regulator stages
• Ideal for motor-drive half-bridge circuits
• Used with DC-DC converters in server power supplies
• Can be used for battery management and power distribution
• Appropriate for high-current point-of-load switching

What thermal environment can it withstand during operation?


It is rated to operate between -55 °C and 150 °C, permitting use across industrial and elevated-temperature applications.

What package and mounting method are provided for PCB assembly?


The component is supplied in a TDSON package and is designed for surface mounting to facilitate automated assembly.

What channel type and mode are implemented for switching behaviour?


The device uses an N-channel enhancement-mode topology suitable for low-side and high-side switching when appropriately driven.

How many electrical connections does the device present to a circuit?


It features an 8‑pin configuration to accommodate gate, drain and source connections and thermal conduction paths.

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