Infineon IMLT65 Type N-Channel MOSFET, 82 A, 650 V Enhancement, 16-Pin PG-HDSOP-16 IMLT65R026M2HXTMA1
- RS 제품 번호:
- 351-947
- 제조사 부품 번호:
- IMLT65R026M2HXTMA1
- 제조업체:
- Infineon
대량 구매 할인 기용 가능
Subtotal (1 unit)*
₩26,248.56
재고있음
- 추가로 2025년 12월 29일 부터 1,800 개 단위 배송
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수량 | 한팩당 |
|---|---|
| 1 - 9 | ₩26,248.56 |
| 10 - 99 | ₩23,625.96 |
| 100 + | ₩21,794.84 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 351-947
- 제조사 부품 번호:
- IMLT65R026M2HXTMA1
- 제조업체:
- Infineon
사양
참조 문서
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제품 세부 사항
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Infineon | |
| Channel Type | Type N | |
| Product Type | MOSFET | |
| Maximum Continuous Drain Current Id | 82A | |
| Maximum Drain Source Voltage Vds | 650V | |
| Output Power | 365W | |
| Package Type | PG-HDSOP-16 | |
| Series | IMLT65 | |
| Mount Type | Surface | |
| Pin Count | 16 | |
| Channel Mode | Enhancement | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 175°C | |
| Length | 10.1mm | |
| Width | 10.3 mm | |
| Standards/Approvals | JEDEC | |
| Height | 2.35mm | |
| Automotive Standard | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Infineon | ||
Channel Type Type N | ||
Product Type MOSFET | ||
Maximum Continuous Drain Current Id 82A | ||
Maximum Drain Source Voltage Vds 650V | ||
Output Power 365W | ||
Package Type PG-HDSOP-16 | ||
Series IMLT65 | ||
Mount Type Surface | ||
Pin Count 16 | ||
Channel Mode Enhancement | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 175°C | ||
Length 10.1mm | ||
Width 10.3 mm | ||
Standards/Approvals JEDEC | ||
Height 2.35mm | ||
Automotive Standard No | ||
- COO (Country of Origin):
- MY
The Infineon CoolSiC MOSFET discrete Generation 2 (G2) in TOLT leverages the G2 best-in-class switching performance while enabling all the benefits of top-side cooling. Complementing the Q-DPAK package, it is now possible to implement a total discrete top-side cooling solution, obtaining better thermal performance, system cost reduction and simplification, and a cheaper assembly.
Enables BOM savings
Highest reliability
Enables top efficiency and power density
Simplifies assembly and cooling
Liquid cooling ready
Allows designs without fan or heatsink
Lower stray inductances
Better gate control
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