Infineon OptiMOS 5 N-Channel Power MOSFET, 87 A, 150 V Enhancement, 8-Pin PG-TDSON-8 BSC088N15LS5ATMA1

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RS 제품 번호:
349-395
제조사 부품 번호:
BSC088N15LS5ATMA1
제조업체:
Infineon
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모두 선택

브랜드

Infineon

Product Type

Power MOSFET

Channel Type

N

Maximum Continuous Drain Current Id

87A

Maximum Drain Source Voltage Vds

150V

Series

OptiMOS 5

Package Type

PG-TDSON-8

Mount Type

Surface

Pin Count

8

Maximum Drain Source Resistance Rds

8.8mΩ

Channel Mode

Enhancement

Minimum Operating Temperature

-55°C

Maximum Power Dissipation Pd

139W

Maximum Gate Source Voltage Vgs

20V

Typical Gate Charge Qg @ Vgs

40nC

Forward Voltage Vf

1.20V

Maximum Operating Temperature

150°C

Standards/Approvals

DIN IEC 68-1: 55/175/56, IEC61249-2-21, RoHS

Automotive Standard

No

COO (Country of Origin):
CN

Infineon OptiMOS 5 Series Power MOSFET, 150V Maximum Drain-Source Voltage, 139W Maximum Power Dissipation - BSC088N15LS5ATMA1


This power MOSFET is a surface-mount N‑channel enhancement device designed for high-current switching and power conversion tasks. It operates across a wide temperature range and is suited to applications requiring efficient conduction at elevated voltages. The device includes gate protection and complies with recognised material and temperature endurance standards while meeting RoHS requirements.

Features and Benefits:


• 8.8mΩ RDS(on) reduces conduction losses and improves efficiency
• 87A continuous drain current supports high-current designs
• 1.20V forward voltage lowers on-state voltage drop
• 40 nC typical gate charge enables Rapid switching transitions
• 20V gate-source limit provides robust gate protection

Applications


• Suitable for high-power DC-DC converters in industrial equipment
• Used with motor drivers requiring sustained high current
• Ideal for switch‑mode power supplies in telecoms systems
• Can be used for battery management and power distribution
• Suitable for high-power low-loss switching in inverters

What thermal endurance does it offer under continuous operation?


It is rated to operate from -55°C up to 150°C, providing broad thermal headroom for demanding environments.

Which package and mounting style support Compact assemblies?


The PG‑TDSON‑8 package is intended for surface‑mount placement to enable space‑efficient board layouts.

What standards and material constraints apply to its manufacture?


The device meets DIN IEC 68‑1:55/175/56, IEC 61249‑2‑21 and is RoHS compliant.

How does the device behave in terms of switching performance?


With a typical gate charge of 40 nC and enhancement‑channel operation, it supports fast gate transitions for efficient switching.

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