TDK 220 nF Multilayer Ceramic Capacitor, 250V dc, ±10 %, Surface
- RS 제품 번호:
- 179-5008
- 제조사 부품 번호:
- CGA5L3X7T2E224K160AE
- 제조업체:
- TDK
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- RS 제품 번호:
- 179-5008
- 제조사 부품 번호:
- CGA5L3X7T2E224K160AE
- 제조업체:
- TDK
사양
참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TDK | |
| Product Type | Multilayer Ceramic Capacitor | |
| Capacitance | 220nF | |
| Voltage | 250V dc | |
| Package/Case | 1206 | |
| Mount Type | Surface | |
| Packaging | Tape & Reel | |
| Dielectric | X7T | |
| Tolerance | ±10 % | |
| Automotive Standard | AEC-Q200 | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -55°C | |
| Series | CGA | |
| Width | 1.6mm | |
| Standards/Approvals | No | |
| Length | 3.2mm | |
| Height | 1.6mm | |
| Suppression Class | Class II | |
| Maximum Operating Temperature | 125°C | |
| 모두 선택 | ||
|---|---|---|
브랜드 TDK | ||
Product Type Multilayer Ceramic Capacitor | ||
Capacitance 220nF | ||
Voltage 250V dc | ||
Package/Case 1206 | ||
Mount Type Surface | ||
Packaging Tape & Reel | ||
Dielectric X7T | ||
Tolerance ±10 % | ||
Automotive Standard AEC-Q200 | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -55°C | ||
Series CGA | ||
Width 1.6mm | ||
Standards/Approvals No | ||
Length 3.2mm | ||
Height 1.6mm | ||
Suppression Class Class II | ||
Maximum Operating Temperature 125°C | ||
- COO (Country of Origin):
- JP
TDK multilayer ceramic chip capacitor_Soft termination_Automotive grade_CGA series is a product which conductive resin layers are included in terminations. Soft termination series has higher mechanical endurance by the flexible resin layers which absorbs thermal and mechanical stress.
FEATURES
Higher mechanical endurance is realized by flexible resin layers.
X8R type which maximum temperature is up to 150°C is applicable.
C0G temperature characteristic which has excellent stable temperature and DC-bias characteristics is applicable.
APPLICATIONS
Fail-safe design in battery line.
Prevention of ceramic body cracks by board bending.
Prevention of solder cracks by thermal shock.
The set having a high probability of fall such as keyless entry and
Smart-key
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