TE Connectivity 0.5mm Pitch 260 Way, Right Angle SMT Mount SO DIMM Socket ,25.0 V ,500.0mA
- RS 제품 번호:
- 185-5879P
- 제조사 부품 번호:
- 2309409-1
- 제조업체:
- TE Connectivity
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- RS 제품 번호:
- 185-5879P
- 제조사 부품 번호:
- 2309409-1
- 제조업체:
- TE Connectivity
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참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TE Connectivity | |
| Gender | Female | |
| Memory Socket Type | DIMM Socket | |
| Body Orientation | Right Angle | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold Flash, Nickel Plated (Under Plated) | |
| Number of Contacts | 260 | |
| Pitch | 0.5mm | |
| Mounting Type | Surface Mount | |
| Termination Method | Solder | |
| Housing Material | Thermoplastic | |
| SDRAM Type | SO | |
| Latching | Yes | |
| Row Spacing | 8.2mm | |
| Maximum Contact Resistance | 50.0mΩ | |
| Current Rating | 500.0mA | |
| Minimum Operating Temperature | +85°C | |
| Voltage Rating | 25.0 V | |
| Maximum Operating Temperature | +85°C | |
| Series Number | 2309409 | |
| 모두 선택 | ||
|---|---|---|
브랜드 TE Connectivity | ||
Gender Female | ||
Memory Socket Type DIMM Socket | ||
Body Orientation Right Angle | ||
Contact Material Copper Alloy | ||
Contact Plating Gold Flash, Nickel Plated (Under Plated) | ||
Number of Contacts 260 | ||
Pitch 0.5mm | ||
Mounting Type Surface Mount | ||
Termination Method Solder | ||
Housing Material Thermoplastic | ||
SDRAM Type SO | ||
Latching Yes | ||
Row Spacing 8.2mm | ||
Maximum Contact Resistance 50.0mΩ | ||
Current Rating 500.0mA | ||
Minimum Operating Temperature +85°C | ||
Voltage Rating 25.0 V | ||
Maximum Operating Temperature +85°C | ||
Series Number 2309409 | ||
TE Connectivity’s (TE) main memory connectors are made to JEDEC industry standards for dual in-line memory modules (DIMM) and small outline DIMM (SO DIMM) as well as custom memory modules for server, workstation, desktop, notebook, storage and communication applications. Our memory socket portfolio covers the DDR2, DDR3, and DDR4 generations of sockets. Each product family consists of vertical and a few right-angle and various-angled configurations in solder tail and surface mount (SMT) mounting options.
Designed to JEDEC industry standards for new and existing DIMM memory modules
Provide end latches for module retention, ejection and mechanical voltage keying
SO DIMM sockets are offered in several stacking heights to maximize board space
Applications
Servers
High Performance Computing (HPC)
Workstations
Mass storages
Communication equipment
Desktop PCs
Instrument equipment
Provide end latches for module retention, ejection and mechanical voltage keying
SO DIMM sockets are offered in several stacking heights to maximize board space
Applications
Servers
High Performance Computing (HPC)
Workstations
Mass storages
Communication equipment
Desktop PCs
Instrument equipment
For these non-cancellable (NC), and non-returnable (NR) products, Terms and Conditions apply.
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