TE Connectivity 0.6 mm Pitch 200 Way, Straight Board Mount DDR Socket ,2.5V, 500mA
- RS 제품 번호:
- 795-279
- 제조사 부품 번호:
- 5-1612773-1
- 제조업체:
- TE Connectivity
N
Subtotal (1 tray of 10 units)*
₩314,904.00
제조사가 재고 비축중
- 2026년 9월 16일 부터 배송 준비 완료
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Tray(s) | Per Tray | 한팩당* |
|---|---|---|
| 1 + | ₩314,904.00 | ₩31,490.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 795-279
- 제조사 부품 번호:
- 5-1612773-1
- 제조업체:
- TE Connectivity
사양
참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TE Connectivity | |
| Product Type | Socket | |
| Memory Socket Type | Memory Card | |
| Insertion/Removal Method | Cam-In | |
| Orientation | Straight | |
| Current | 500mA | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold Flash | |
| Number of Contacts | 200 | |
| Pitch | 0.6mm | |
| Mount Type | Board | |
| Housing Material | High Temperature Thermoplastic | |
| SDRAM Type | DDR | |
| Minimum Operating Temperature | -55°C | |
| Termination Type | Surface Mount | |
| Row Spacing | 6.2mm | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | UL 94V-0 | |
| Voltage | 2.5V | |
| Series | DDR2 SO DIMM | |
| 모두 선택 | ||
|---|---|---|
브랜드 TE Connectivity | ||
Product Type Socket | ||
Memory Socket Type Memory Card | ||
Insertion/Removal Method Cam-In | ||
Orientation Straight | ||
Current 500mA | ||
Contact Material Copper Alloy | ||
Contact Plating Gold Flash | ||
Number of Contacts 200 | ||
Pitch 0.6mm | ||
Mount Type Board | ||
Housing Material High Temperature Thermoplastic | ||
SDRAM Type DDR | ||
Minimum Operating Temperature -55°C | ||
Termination Type Surface Mount | ||
Row Spacing 6.2mm | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals UL 94V-0 | ||
Voltage 2.5V | ||
Series DDR2 SO DIMM | ||
- COO (Country of Origin):
- CN
The TE Connectivity Connector is designed for Double Data Rate (DDR) applications, featuring a Compact 6.5 mm stack height and right-angle module orientation for effective space utilisation in electronic devices.
Double Data Rate (DDR) support ensures high-performance memory connections
Right angle module orientation optimises board space for Compact designs
200 positions allow for versatile integration in various configurations
Operating temperature range accommodates diverse environmental conditions
Gold flash plating enhances durability and signal integrity
High-temperature thermoplastic housing offers robust protection
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