Amphenol ICC 0.6 mm Pitch 200 Way, Straight Surface Mount Mount DDR2 DIMM Socket ,50V
- RS 제품 번호:
- 787-124
- 제조사 부품 번호:
- 10116658-052FSLF
- 제조업체:
- Amphenol ICC
N
Subtotal (1 tray of 10 units)*
₩441,253.80
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Tray(s) | Per Tray | 한팩당* |
|---|---|---|
| 1 + | ₩441,253.80 | ₩44,124.60 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 787-124
- 제조사 부품 번호:
- 10116658-052FSLF
- 제조업체:
- Amphenol ICC
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Amphenol ICC | |
| Product Type | DIMM Socket | |
| Memory Socket Type | SODIMM | |
| Orientation | Straight | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Number of Contacts | 200 | |
| Pitch | 0.6mm | |
| Mount Type | Surface Mount | |
| Housing Material | LCP | |
| SDRAM Type | DDR2 | |
| Latching | Yes | |
| Termination Type | Surface Mount | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 85°C | |
| Row Spacing | 3mm | |
| Standards/Approvals | UL 94V-0 | |
| Series | 10116658 | |
| Voltage | 50V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Amphenol ICC | ||
Product Type DIMM Socket | ||
Memory Socket Type SODIMM | ||
Orientation Straight | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Number of Contacts 200 | ||
Pitch 0.6mm | ||
Mount Type Surface Mount | ||
Housing Material LCP | ||
SDRAM Type DDR2 | ||
Latching Yes | ||
Termination Type Surface Mount | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 85°C | ||
Row Spacing 3mm | ||
Standards/Approvals UL 94V-0 | ||
Series 10116658 | ||
Voltage 50V | ||
- COO (Country of Origin):
- CN
The Amphenol Module Socket is designed for reliable performance within various applications, ensuring durability and efficiency. It boasts a robust construction tailored to meet industry standards, making it an essential component for professionals seeking quality.
Released status indicates approved availability for user deployment
Printed date of Apr 22, 2011, provides documentation reference
Included .STATUS tag ensures clear communication of product readiness
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