Molex 1 mm Pitch 240 Way, Vertical Through Hole Mount DDR3 Socket ,30V, 1A
- RS 제품 번호:
- 693-845
- 제조사 부품 번호:
- 78315-0011
- 제조업체:
- Molex
N
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Subtotal (1 tray of 20 units)*
₩421,258.50
제조사가 재고 비축중
- 2026년 6월 15일 부터 배송 준비 완료
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Tray(s) | Per Tray | 한팩당* |
|---|---|---|
| 1 + | ₩421,258.50 | ₩21,063.90 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 693-845
- 제조사 부품 번호:
- 78315-0011
- 제조업체:
- Molex
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Memory Socket Type | DIMM | |
| Product Type | Socket | |
| Orientation | Vertical | |
| Insertion/Removal Method | Latched | |
| Contact Material | Copper Alloy | |
| Current | 1A | |
| Contact Plating | Gold | |
| Number of Contacts | 240 | |
| Pitch | 1mm | |
| Mount Type | Through Hole | |
| Housing Material | Nylon | |
| SDRAM Type | DDR3 | |
| Termination Type | Press Fit | |
| Latching | Yes | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | UL E29179 | |
| Voltage | 30V | |
| Series | 78315 | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Memory Socket Type DIMM | ||
Product Type Socket | ||
Orientation Vertical | ||
Insertion/Removal Method Latched | ||
Contact Material Copper Alloy | ||
Current 1A | ||
Contact Plating Gold | ||
Number of Contacts 240 | ||
Pitch 1mm | ||
Mount Type Through Hole | ||
Housing Material Nylon | ||
SDRAM Type DDR3 | ||
Termination Type Press Fit | ||
Latching Yes | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals UL E29179 | ||
Voltage 30V | ||
Series 78315 | ||
- COO (Country of Origin):
- ID
The Molex DDR3 DIMM Socket is designed to provide superior connectivity for memory modules while ensuring optimal durability. Featuring a very low-profile and aerodynamic design, this socket is Ideal for applications requiring efficient space utilisation. The component boasts a vertical entry angle and is meticulously engineered for press-fit assembly, making installation straightforward. With a tin-plated termination and 0.76μm gold plating on the mating surface, this part ensures excellent electrical performance and long-term reliability. Capable of accommodating up to 240 circuits, it is perfect for Advanced memory solutions, including compliance with various industry standards, and is suited for use in lead-free environments.
Obsolete status ensures clarity for legacy compatibility
High durability with a maximum of 25 mating cycles, optimising lifespan
Supports vertical entry for streamlined integration in Compact designs
Compliance with key directives such as EU RoHS and REACH SVHC
Accommodates a PCB thickness of 2.60mm, strict adherence to design specifications
Works seamlessly with standard 1.27mm JEDEC modules which ensuring versatility
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