Infineon FS200R12KT4RBOSA1, Type N-Channel IGBT Module, 280 A 1200 V, 35-Pin EconoPACK 3, Clamp

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  • 2028년 7월 25일 부터 배송
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포장 옵션
RS 제품 번호:
110-7155
제조사 부품 번호:
FS200R12KT4RBOSA1
제조업체:
Infineon
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

Infineon

Product Type

IGBT Module

Maximum Continuous Collector Current Ic

280A

Maximum Collector Emitter Voltage Vceo

1200V

Maximum Power Dissipation Pd

1kW

Package Type

EconoPACK 3

Mount Type

Clamp

Channel Type

Type N

Pin Count

35

Maximum Gate Emitter Voltage VGEO

20 V

Minimum Operating Temperature

-40°C

Maximum Collector Emitter Saturation Voltage VceSAT

2.15V

Maximum Operating Temperature

150°C

Height

17mm

Standards/Approvals

No

Length

122mm

Width

62mm

Automotive Standard

No

해당 안됨

Infineon IGBT Module, 1200V Max Collector Emitter Voltage, 280A Max Continuous Collector Current - FS200R12KT4RBOSA1


This IGBT module is a high-power semiconductor assembly designed to control and switch large DC currents in industrial power converters. It supports heavy-duty operation across a wide temperature range and is packaged for straightforward mounting in commercial power systems. The device offers a high collector-emitter voltage rating and substantial continuous current capability suited to demanding switching applications.

Features and Benefits:


• 1200V collector-emitter rating enabling high-voltage switching
• 280A continuous collector current for sustained high-load operation
• 2.15V low VCE(sat) reducing conduction losses during on-state
• 1kW maximum power dissipation for elevated power handling
• 20V gate-emitter rating allowing robust gate drive margins
• 35-pin Type N configuration for multiple control and sensing connections

Applications


• Suitable for industrial motor drives requiring high-voltage switching
• Ideal for inverter stages in renewable-energy converters
• Used with traction and heavy-equipment inverters in harsh environments
• Can be used for power supplies and UPS systems with high current needs
• Suitable for laboratory and test rigs validating high-power switching designs

What mounting method does it require for chassis integration?


It uses a clamp-mounting system that secures the package to heat-sinking surfaces for thermal contact and mechanical stability.

How compact is this module for dense power assemblies?


The package footprint measures 122x62mm, providing a compact form factor for tight layouts while supporting high-power operation.

What environmental temperatures can it tolerate during operation?


It is specified to operate reliably from -40 °C up to 150 °C, permitting use in both cold-start and high-temperature conditions.

What package style is used for thermal and electrical layout consistency?


The module is presented in an EconoPACK 3 package to standardise mounting and thermal-interface considerations.

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