Infineon FS1150R08A8P3LMCHPSA1, Type N-Channel Half Bridge IGBT, 600 A 750 V, Screw
- RS 제품 번호:
- 349-029
- 제조사 부품 번호:
- FS1150R08A8P3LMCHPSA1
- 제조업체:
- Infineon
Subtotal (1 unit)*
₩1,756,126.80
일시적 품절
- 2026년 9월 28일 부터 배송
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수량 | 한팩당 |
|---|---|
| 1 + | ₩1,756,126.80 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 349-029
- 제조사 부품 번호:
- FS1150R08A8P3LMCHPSA1
- 제조업체:
- Infineon
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Infineon | |
| Product Type | IGBT | |
| Maximum Continuous Collector Current Ic | 600A | |
| Maximum Collector Emitter Voltage Vceo | 750V | |
| Maximum Power Dissipation Pd | 1kW | |
| Number of Transistors | 6 | |
| Configuration | Half Bridge | |
| Mount Type | Screw | |
| Channel Type | Type N | |
| Maximum Collector Emitter Saturation Voltage VceSAT | 1.22V | |
| Maximum Gate Emitter Voltage VGEO | 20 V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 185°C | |
| Standards/Approvals | RoHS, UL 94 V0 | |
| Automotive Standard | AQG 324 | |
| 모두 선택 | ||
|---|---|---|
브랜드 Infineon | ||
Product Type IGBT | ||
Maximum Continuous Collector Current Ic 600A | ||
Maximum Collector Emitter Voltage Vceo 750V | ||
Maximum Power Dissipation Pd 1kW | ||
Number of Transistors 6 | ||
Configuration Half Bridge | ||
Mount Type Screw | ||
Channel Type Type N | ||
Maximum Collector Emitter Saturation Voltage VceSAT 1.22V | ||
Maximum Gate Emitter Voltage VGEO 20 V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 185°C | ||
Standards/Approvals RoHS, UL 94 V0 | ||
Automotive Standard AQG 324 | ||
- COO (Country of Origin):
- DE
The Infineon HybridPACK Drive G2 module is a very compact six pack power module with enhanced package optimized for hybrid and electric vehicles. The power module implements Infineon’s next generation chip technology EDT3 750V, optimized for electric drive train applications, from mid to high range automotive power classes.
Low inductive design
4.2 kV DC 1 second insulation
High creepage and clearance distances
Direct cooled PinFin base plate
PCB and cooler assembly guidelines
PressFIT contact technology
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