SPREADFAST Heatsink, Universal Square Ceramic, 2.4°C/W, 5.2 °C/W 15 mm 60 mm 50 mm
- RS 제품 번호:
- 123-5621
- 제조사 부품 번호:
- SF-CHS-606015P
- 제조업체:
- SPREADFAST
대량 구매 할인 기용 가능
Subtotal (1 unit)*
₩9,964.00
재고있음
- 98 개 단위 배송 준비 완료
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.
수량 | 한팩당 |
|---|---|
| 1 - 24 | ₩9,964.00 |
| 25 - 49 | ₩9,588.00 |
| 50 - 99 | ₩9,155.60 |
| 100 + | ₩8,967.60 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 123-5621
- 제조사 부품 번호:
- SF-CHS-606015P
- 제조업체:
- SPREADFAST
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | SPREADFAST | |
| For Use With | Universal Square Ceramic | |
| Product Type | Heatsink | |
| Length | 60mm | |
| Width | 50 mm | |
| Height | 15mm | |
| Thermal Resistance | 2.4, 5.2°C/W | |
| Fastening | Adhesive, Screw | |
| Series | Pin Fin | |
| Colour | White | |
| Standards/Approvals | RoHS | |
| Material | Aluminium Oxide | |
| Special Features | Good Thermal Cycling Stability, High Volume Resistivity, High Breakdown Voltage, Lower density, Good EMC, Good Heat Spreader, Ideal for Direct Metalisation | |
| 모두 선택 | ||
|---|---|---|
브랜드 SPREADFAST | ||
For Use With Universal Square Ceramic | ||
Product Type Heatsink | ||
Length 60mm | ||
Width 50 mm | ||
Height 15mm | ||
Thermal Resistance 2.4, 5.2°C/W | ||
Fastening Adhesive, Screw | ||
Series Pin Fin | ||
Colour White | ||
Standards/Approvals RoHS | ||
Material Aluminium Oxide | ||
Special Features Good Thermal Cycling Stability, High Volume Resistivity, High Breakdown Voltage, Lower density, Good EMC, Good Heat Spreader, Ideal for Direct Metalisation | ||
Spreadfast SF-CHS Series Square Pin Ceramic Heatsink
Spreadfast SF-CHS series of square pin ceramic heatsinks have been designed as a lower density improvement over traditional metal heatsinks. The innate characteristics of ceramic heatsinks means the SF-CHS series have a high breakdown voltage and heat dissipation. Thanks to the meticulous design of these ceramic heatsinks, the SF-CHS series are ideally suited to applications where thermal cycling stability are required.
Typical Applications
Traditional heatsink replacement.
LED & chipset cooling.
Power modules.
IC cooling.
Ceramic Heatsinks
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