SPREADFAST Heatsink, Universal Square Ceramic, 12.7 °C/W @ 400 lfm, 24.0 °C/W @ 100 lfm, 23 x 23 x 10mm, Adhesive, Screw
- RS 제품 번호:
- 123-5633
- 제조사 부품 번호:
- SF-CHS-232310-PC
- 제조업체:
- SPREADFAST
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- RS 제품 번호:
- 123-5633
- 제조사 부품 번호:
- SF-CHS-232310-PC
- 제조업체:
- SPREADFAST
사양
참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | SPREADFAST | |
| For Use With | Universal Square Ceramic | |
| Length | 23mm | |
| Width | 23mm | |
| Height | 10mm | |
| Dimensions | 23 x 23 x 10mm | |
| Thermal Resistance | 12.7 °C/W @ 400 lfm, 24.0 °C/W @ 100 lfm | |
| Mounting | Adhesive, Screw | |
| Colour | White | |
| Series | Pin Fin | |
| Material | Ceramic | |
| Application | Chipset, Cooling, IC Cooling, LED, Metal Heat Sink Replacement, Power Modules | |
| Special Features | Lower Density, High Breakdown Voltage, Good Heat Spreader, High Volume Resistivity, Good EMC, Ideal for Direct Metalisation, Good Thermal Cycling Stability | |
| 모두 선택 | ||
|---|---|---|
브랜드 SPREADFAST | ||
For Use With Universal Square Ceramic | ||
Length 23mm | ||
Width 23mm | ||
Height 10mm | ||
Dimensions 23 x 23 x 10mm | ||
Thermal Resistance 12.7 °C/W @ 400 lfm, 24.0 °C/W @ 100 lfm | ||
Mounting Adhesive, Screw | ||
Colour White | ||
Series Pin Fin | ||
Material Ceramic | ||
Application Chipset, Cooling, IC Cooling, LED, Metal Heat Sink Replacement, Power Modules | ||
Special Features Lower Density, High Breakdown Voltage, Good Heat Spreader, High Volume Resistivity, Good EMC, Ideal for Direct Metalisation, Good Thermal Cycling Stability | ||
- COO (Country of Origin):
- CN
Spreadfast SF-CHS Series Round Pin Ceramic Heatsink
Spreadfast SF-CHS series of round pin ceramic heatsinks have been designed as a lower density improvement over traditional metal heatsinks. The innate characteristics of ceramic heatsinks means the SF-CHS series have a high breakdown voltage and heat dissipation. Thanks to the meticulous design of these ceramic heatsinks, the SF-CHS series are ideally suited to applications where thermal cycling stability are required.
Typical Applications
Traditional heatsink replacement.
LED & chipset cooling.
Power modules.
IC cooling.
Traditional heatsink replacement.
LED & chipset cooling.
Power modules.
IC cooling.
Ceramic Heatsinks
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