Infineon 1EDB8275FXUMA1 MOSFET Gate Driver 1, 5.6 A 8-Pin 15V, PG-DSO-8

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  • 2027년 7월 19일 부터 배송
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RS 제품 번호:
234-8940
제조사 부품 번호:
1EDB8275FXUMA1
제조업체:
Infineon
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모두 선택

브랜드

Infineon

Product Type

Gate Driver

Output Current

5.6A

Pin Count

8

Package Type

PG-DSO-8

Fall Time

9ns

Number of Outputs

2

Driver Type

MOSFET

Rise Time

8.3ns

Minimum Supply Voltage

3V

Maximum Supply Voltage

15V

Number of Drivers

1

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

125°C

Series

1EDB8275F

Width

4mm

Standards/Approvals

No

Length

5mm

Height

1.75mm

Mount Type

Surface

Automotive Standard

No

Infineon 1EDB8275F Series Gate Driver, 5.6A Output Current, 3V Minimum Supply Voltage - 1EDB8275FXUMA1


This gate driver provides a Compact Interface to control power MOSFETs in low-voltage systems, delivering a single high-current driving channel with dual outputs for switching applications. It operates across a moderate supply range and is intended for surface-mount integration where fast switching transitions and a small package footprint are required.

Features and Benefits:


• Drives MOSFET Gates with 5.6A output current for Rapid switching performance
• Operates from 3V to 15V supply for flexible low-voltage use
• Achieves 8.3ns rise time for reduced turn-on losses
• Delivers 9ns fall time to limit switching stress on devices
• Single driver with two outputs for simplified gate control
• Surface-mount 8-pin DSO-8 package for Compact PCB layouts

Applications


• Suitable for MOSFET gate control in switch-mode power supplies
• Ideal for motor-drive inverter gate buffering tasks
• Used with DC-DC converters requiring fast transitions
• Can be used for synchronous rectifier gate drive circuits
• Useful in power electronics prototyping on Compact boards

What ambient temperature range can it tolerate?


It is specified to operate between -40°C and 125°C.

How many pins are available for PCB layout considerations?


The device is supplied in an 8-pin package for footprint planning.

What mounting style is required for assembly?


It is intended for surface-mount placement on the board.

Are the package dimensions suitable for dense assemblies?


The package measures 4 mm in width, 5 mm in length and 1.75 mm in height.

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