Infineon 4 kB FRAM 8-Pin SOIC
- RS 제품 번호:
- 181-8319P
- 제조사 부품 번호:
- FM24CL04B-GTR
- 제조업체:
- Infineon
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대량 구매 할인 기용 가능
View bulk pricing optionsSubtotal 625 units (supplied on a reel)*
₩2,242,500.00
현재 액세스할 수 없는 재고 정보 - 나중에 다시 확인해 주세요.
수량 | 한팩당 |
|---|---|
| 625 - 1245 | ₩3,588.00 |
| 1250 + | ₩3,516.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 181-8319P
- 제조사 부품 번호:
- FM24CL04B-GTR
- 제조업체:
- Infineon
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Infineon | |
| Product Type | FRAM | |
| Memory Size | 4kB | |
| Organisation | 512M x 8 bit | |
| Data Bus Width | 8bit | |
| Maximum Random Access Time | 550ns | |
| Mount Type | Surface | |
| Maximum Clock Frequency | 1MHz | |
| Package Type | SOIC | |
| Pin Count | 8 | |
| Length | 4.97mm | |
| Standards/Approvals | No | |
| Width | 3.98mm | |
| Height | 1.38mm | |
| Maximum Operating Temperature | 85°C | |
| Minimum Operating Temperature | -40°C | |
| Minimum Supply Voltage | 2.7V | |
| Maximum Supply Voltage | 3.65V | |
| Number of Words | 512M | |
| Number of Bits per Word | 8 | |
| Automotive Standard | AEC-Q100 | |
| 모두 선택 | ||
|---|---|---|
브랜드 Infineon | ||
Product Type FRAM | ||
Memory Size 4kB | ||
Organisation 512M x 8 bit | ||
Data Bus Width 8bit | ||
Maximum Random Access Time 550ns | ||
Mount Type Surface | ||
Maximum Clock Frequency 1MHz | ||
Package Type SOIC | ||
Pin Count 8 | ||
Length 4.97mm | ||
Standards/Approvals No | ||
Width 3.98mm | ||
Height 1.38mm | ||
Maximum Operating Temperature 85°C | ||
Minimum Operating Temperature -40°C | ||
Minimum Supply Voltage 2.7V | ||
Maximum Supply Voltage 3.65V | ||
Number of Words 512M | ||
Number of Bits per Word 8 | ||
Automotive Standard AEC-Q100 | ||
Infineon FRAM, 4kB Memory Size, 3.65V Maximum Supply Voltage - FM24CL04B-GTR
This FRAM is a non-volatile memory device designed for low-power data storage in embedded and automotive systems. It operates within a typical single-supply range and provides byte-wide data access for firmware, calibration tables and logging tasks in space-constrained surface-mount designs. The component meets automotive stress requirements and is suitable for use across a broad industrial temperature range.
Features and Benefits:
• 8-bit data bus enabling simple byte-wise interfacing and firmware updates
• 1MHz clock supporting timely serial access for control systems
• 550ns maximum random access time reducing read latency in real-time tasks
• Operates from 2.7V to 3.65V providing compatibility with common supply rails
• AEC‑Q100 qualification permitting deployment in automotive electronic modules
• Surface-mount SOIC package allowing automated assembly on compact PCBs
• 1MHz clock supporting timely serial access for control systems
• 550ns maximum random access time reducing read latency in real-time tasks
• Operates from 2.7V to 3.65V providing compatibility with common supply rails
• AEC‑Q100 qualification permitting deployment in automotive electronic modules
• Surface-mount SOIC package allowing automated assembly on compact PCBs
Applications
• Suitable for automotive CAN node parameter storage
• Ideal for instrumentation requiring frequent non-volatile writes
• Used with microcontroller systems for calibration data retention
• Can be used for event logging in industrial control equipment
• Used for low-power battery-backed data buffering in sensors
• Ideal for instrumentation requiring frequent non-volatile writes
• Used with microcontroller systems for calibration data retention
• Can be used for event logging in industrial control equipment
• Used for low-power battery-backed data buffering in sensors
What voltage margins should designers expect when integrating this device?
The device functions across a minimum supply of 2.7V up to a maximum of 3.65V, allowing designers to select regulators and supervision thresholds that maintain reliable operation within that window.
How does the device perform under varying ambient temperatures?
It is specified to operate between -40°C and 85°C, ensuring predictable electrical behaviour for applications spanning industrial to automotive thermal environments.
What package considerations affect PCB layout for this component?
The package is a surface-mounted SOIC with a pin count of 8, so footprint clearance and solder fillet control should follow standard SOIC assembly practices to maintain mechanical and thermal integrity.
What is the organisation and capacity relevant to addressing?
Memory is organised as 512M words by 8 bits, providing a total count of addressable 8-bit locations appropriate for compact non-volatile storage needs.
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