Infineon 64 kB SPI FRAM 8-Pin SOIC, CY15B064Q-SXE

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₩22,340.00

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2 - 22₩11,170.00₩22,340.00
24 - 46₩10,930.00₩21,860.00
48 +₩10,680.00₩21,360.00

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포장 옵션
RS 제품 번호:
181-7565
제조사 부품 번호:
CY15B064Q-SXE
제조업체:
Infineon
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모두 선택

브랜드

Infineon

Memory Size

64kB

Product Type

FRAM

Organisation

8K x 8 bit

Interface Type

SPI

Data Bus Width

8bit

Maximum Random Access Time

25ns

Maximum Clock Frequency

16MHz

Mount Type

Surface

Package Type

SOIC

Pin Count

8

Height

1.5mm

Standards/Approvals

No

Length

3.8mm

Width

4.8mm

Maximum Operating Temperature

125°C

Minimum Operating Temperature

-40°C

Maximum Supply Voltage

3.6V

Minimum Supply Voltage

3V

Number of Bits per Word

8

Automotive Standard

AEC-Q100

Number of Words

8K

Infineon FRAM, 64kB Memory Size, 3.6V Maximum Supply Voltage - CY15B064Q-SXE


This FRAM is a non-volatile memory device designed for serial interfaces in embedded and automotive environments. It operates from a low-voltage supply and delivers fast read/write responsiveness over an SPI connection, making it suitable for systems that require frequent data logging and persistent storage across power cycles. The component is supplied in a compact surface-mount package compatible with standard board assembly.

Features and Benefits:


• Operates up to 16MHz for high-speed serial transfers
• Provides 64kB storage with 8K words for data retention
• 25ns random access enables rapid read/write operations
• 8-bit data bus simplifies interfacing with microcontrollers
• Accepts 3.0V-3.6V supply for low-power system integration
• Qualified to automotive stress levels for harsh environments

Applications


• Suitable for vehicle data logging and parameter storage
• Ideal for industrial control systems requiring endurance
• Used with sensor hubs needing frequent non-volatile writes
• Can be used for calibration and configuration memory in ECUs
• Suitable for embedded systems demanding fast persistent memory

What temperature range can the device tolerate in demanding installations?


It supports operation from -40°C to 125°C, enabling use across industrial and automotive thermal profiles.

How is the device packaged for PCB assembly and space-constrained designs?


It is supplied in a surface-mount SOIC package with an 8-pin footprint suited to automated placement.

What interface and signalling does it use for communication with controllers?


Communication is via an SPI serial interface, providing synchronous serial transfers for host controllers.

How does the device address automotive reliability requirements?


It meets automotive-grade AEC-Q100 standards appropriate for in-vehicle electronic applications.

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