Xilinx FPGA XC2S150-5PQG208C, Spartan-II 3888 Cells, 150000 Gates, 55296bit, 864 Blocks, 208-Pin PQFP
- RS 제품 번호:
- 626-0450P
- 제조사 부품 번호:
- XC2S150-5PQG208C
- 제조업체:
- Xilinx
대량 구매 할인 기용 가능
Subtotal 5 units (supplied in a tray)*
₩264,920.20
현재 액세스할 수 없는 재고 정보
수량 | 한팩당 |
|---|---|
| 5 - 9 | ₩52,984.04 |
| 10 - 24 | ₩51,944.40 |
| 25 - 49 | ₩50,925.44 |
| 50 + | ₩49,927.16 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 626-0450P
- 제조사 부품 번호:
- XC2S150-5PQG208C
- 제조업체:
- Xilinx
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Xilinx | |
| Family Name | Spartan-II | |
| Number of Logic Gates | 150000 | |
| Number of Logic Cells | 3888 | |
| Number of Logic Units | 864 | |
| Mounting Type | Surface Mount | |
| Package Type | PQFP | |
| Pin Count | 208 | |
| Number of RAM Bits | 55296bit | |
| Dimensions | 28 x 28 x 3.4mm | |
| Height | 3.4mm | |
| Length | 28mm | |
| Minimum Operating Supply Voltage | 2.375 V | |
| Minimum Operating Temperature | 0 °C | |
| Maximum Operating Temperature | +85 °C | |
| Width | 28mm | |
| Maximum Operating Supply Voltage | 2.625 V | |
| 모두 선택 | ||
|---|---|---|
브랜드 Xilinx | ||
Family Name Spartan-II | ||
Number of Logic Gates 150000 | ||
Number of Logic Cells 3888 | ||
Number of Logic Units 864 | ||
Mounting Type Surface Mount | ||
Package Type PQFP | ||
Pin Count 208 | ||
Number of RAM Bits 55296bit | ||
Dimensions 28 x 28 x 3.4mm | ||
Height 3.4mm | ||
Length 28mm | ||
Minimum Operating Supply Voltage 2.375 V | ||
Minimum Operating Temperature 0 °C | ||
Maximum Operating Temperature +85 °C | ||
Width 28mm | ||
Maximum Operating Supply Voltage 2.625 V | ||
- COO (Country of Origin):
- US
Field Programmable Gate Arrays, Xilinx
An FPGA is a semiconductor device consisting of a matrix of Configurable Logic Blocks (CLBs) connected through programmable interconnects. The user determines these interconnections by programming SRAM. A CLB can be simple (AND, OR gates, etc) or complex (a block of RAM). The FPGA allows changes to be made to a design even after the device is soldered into a PCB.
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