Bopla BoLink Series Thermoplastic Elastomer Seal for Use with BoPad 500 Enclosures 36 mm x 136 mm x 81mm

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RS 제품 번호:
200-5499
제조사 부품 번호:
35350000 BOP 500 S
제조업체:
Bopla
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브랜드

Bopla

Product Type

Enclosure Accessory

Accessory Type

Seal

Length

136mm

For Use With

BoPad 500 Enclosures

Width

81mm

Material

Thermoplastic Elastomer

Height

36mm

Colour

Blue

IP Rating

IP65

Series

BoLink

Standards/Approvals

No

Hazardous Area Certification

No

COO (Country of Origin):
DE
The Bopla BoLink IoT Enclosure is a sensor enclosure which is made of polycarbonate material. It is a very intelligent and versatile enclosure system for modern IoT sensor technology. The enclosure is available in three variants without wall brackets, with wall brackets, with wall brackets and lid fixing on top. The PC material is suitable for outdoor use due to f1-listing according to UL 746C.

IP65 rating

UL 94 V0 Fire class

Design seal optional

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