TE Connectivity 2.54mm Pitch Straight 6 Way, Through Hole Ladder IC Dip Socket, 1A
- RS 제품 번호:
- 186-4806
- 제조사 부품 번호:
- 1-2199298-1
- 제조업체:
- TE Connectivity
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RS는 더 이상 이 제품을 입고하지 않습니다.
- RS 제품 번호:
- 186-4806
- 제조사 부품 번호:
- 1-2199298-1
- 제조업체:
- TE Connectivity
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TE Connectivity | |
| Number of Contacts | 6 | |
| Mounting Type | Through Hole | |
| Pitch | 2.54mm | |
| Row Width | 7.62mm | |
| Frame Type | Ladder | |
| Termination Method | Solder | |
| Contact Plating | Tin | |
| Current Rating | 1A | |
| Orientation | Straight | |
| Length | 7.62mm | |
| Width | 10mm | |
| Depth | 5.1mm | |
| Dimensions | 7.62 x 10 x 5.1mm | |
| Maximum Operating Temperature | +105°C | |
| Minimum Operating Temperature | -40°C | |
| Voltage Rating | 250 V ac/dc | |
| Contact Material | Phosphor Bronze | |
| Housing Material | Glass Filled PBT, Thermoplastic | |
| 모두 선택 | ||
|---|---|---|
브랜드 TE Connectivity | ||
Number of Contacts 6 | ||
Mounting Type Through Hole | ||
Pitch 2.54mm | ||
Row Width 7.62mm | ||
Frame Type Ladder | ||
Termination Method Solder | ||
Contact Plating Tin | ||
Current Rating 1A | ||
Orientation Straight | ||
Length 7.62mm | ||
Width 10mm | ||
Depth 5.1mm | ||
Dimensions 7.62 x 10 x 5.1mm | ||
Maximum Operating Temperature +105°C | ||
Minimum Operating Temperature -40°C | ||
Voltage Rating 250 V ac/dc | ||
Contact Material Phosphor Bronze | ||
Housing Material Glass Filled PBT, Thermoplastic | ||
- COO (Country of Origin):
- CN
Our large selection of DIP sockets ranging from 6 to 48 contacts provides a highly reliable connection between your integrated circuit (IC) devices and PCBs. Termination options include through hole and surface mounting, four-finger and dual leaf contacts, as well as a variety of plating options.
6 to 48 positions
Precision four-finger inner contacts or dual leaf contacts are optional
Open frame and closed frame housings
End-to-end and side-to-side stackable
Available with a variety of plating options
Quick IC mating/unmating
Easy field IC replacement
Avoidance of IC overheating during soldering
Flexibility of system upgrade
Large portfolio offers product closest to your need
Applications
Industrial controls
Intelligent buildings
Medical devices
Military
Other embedded systems
Precision four-finger inner contacts or dual leaf contacts are optional
Open frame and closed frame housings
End-to-end and side-to-side stackable
Available with a variety of plating options
Quick IC mating/unmating
Easy field IC replacement
Avoidance of IC overheating during soldering
Flexibility of system upgrade
Large portfolio offers product closest to your need
Applications
Industrial controls
Intelligent buildings
Medical devices
Military
Other embedded systems
For these non-cancellable (NC), and non-returnable (NR) products, Terms and Conditions apply.
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