TE Connectivity 2.54mm Pitch Straight 20 Way, Through Hole Ladder IC Dip Socket, 1A
- RS 제품 번호:
- 186-4946
- 제조사 부품 번호:
- 1-2199298-6
- 제조업체:
- TE Connectivity
대량 구매 할인 기용 가능
Subtotal (1 pack of 10 units)*
₩6,185.20
현재 액세스할 수 없는 재고 정보
수량 | 한팩당 | 한팩당* |
|---|---|---|
| 10 - 590 | ₩618.52 | ₩6,185.20 |
| 600 - 1190 | ₩599.72 | ₩5,997.20 |
| 1200 + | ₩582.80 | ₩5,828.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 186-4946
- 제조사 부품 번호:
- 1-2199298-6
- 제조업체:
- TE Connectivity
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TE Connectivity | |
| Number of Contacts | 20 | |
| Mounting Type | Through Hole | |
| Pitch | 2.54mm | |
| Row Width | 7.62mm | |
| Frame Type | Ladder | |
| Termination Method | Solder | |
| Contact Plating | Tin | |
| Current Rating | 1A | |
| Orientation | Straight | |
| Length | 25.4mm | |
| Width | 10mm | |
| Depth | 5.1mm | |
| Dimensions | 25.4 x 10 x 5.1mm | |
| Maximum Operating Temperature | +105°C | |
| Housing Material | Glass Filled PBT, Thermoplastic | |
| Voltage Rating | 250 V ac/dc | |
| Minimum Operating Temperature | -40°C | |
| Contact Material | Phosphor Bronze | |
| 모두 선택 | ||
|---|---|---|
브랜드 TE Connectivity | ||
Number of Contacts 20 | ||
Mounting Type Through Hole | ||
Pitch 2.54mm | ||
Row Width 7.62mm | ||
Frame Type Ladder | ||
Termination Method Solder | ||
Contact Plating Tin | ||
Current Rating 1A | ||
Orientation Straight | ||
Length 25.4mm | ||
Width 10mm | ||
Depth 5.1mm | ||
Dimensions 25.4 x 10 x 5.1mm | ||
Maximum Operating Temperature +105°C | ||
Housing Material Glass Filled PBT, Thermoplastic | ||
Voltage Rating 250 V ac/dc | ||
Minimum Operating Temperature -40°C | ||
Contact Material Phosphor Bronze | ||
- COO (Country of Origin):
- CN
Our large selection of DIP sockets ranging from 6 to 48 contacts provides a highly reliable connection between your integrated circuit (IC) devices and PCBs. Termination options include through hole and surface mounting, four-finger and dual leaf contacts, as well as a variety of plating options.
6 to 48 positions
Precision four-finger inner contacts or dual leaf contacts are optional
Open frame and closed frame housings
End-to-end and side-to-side stackable
Available with a variety of plating options
Quick IC mating/unmating
Easy field IC replacement
Avoidance of IC overheating during soldering
Flexibility of system upgrade
Large portfolio offers product closest to your need
Applications
Industrial controls
Intelligent buildings
Medical devices
Military
Other embedded systems
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