TE Connectivity 2.54 mm Pitch Vertical 8 Way, Through Hole Standard Pin Ladder DIL Socket, 1A
- RS 제품 번호:
- 185-9254
- Distrelec 제품 번호:
- 304-62-870
- 제조사 부품 번호:
- 1-2199298-2
- 제조업체:
- TE Connectivity
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- RS 제품 번호:
- 185-9254
- Distrelec 제품 번호:
- 304-62-870
- 제조사 부품 번호:
- 1-2199298-2
- 제조업체:
- TE Connectivity
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TE Connectivity | |
| Product Type | DIL Socket | |
| Number of Contacts | 8 | |
| Mount Type | Through Hole | |
| Pin Type | Standard | |
| Current | 1A | |
| Pitch | 2.54mm | |
| Voltage | 250 V ac/dc | |
| Row Width | 7.62mm | |
| Frame Type | Ladder | |
| Contact Plating | Tin | |
| Orientation | Vertical | |
| Minimum Operating Temperature | -40°C | |
| Termination Type | Solder | |
| Maximum Operating Temperature | 105°C | |
| Depth | 5.1mm | |
| Width | 10 mm | |
| Standards/Approvals | No | |
| Length | 7.62mm | |
| Housing Material | Polybutylene Terephthalate | |
| Contact Material | Phosphor Bronze | |
| 모두 선택 | ||
|---|---|---|
브랜드 TE Connectivity | ||
Product Type DIL Socket | ||
Number of Contacts 8 | ||
Mount Type Through Hole | ||
Pin Type Standard | ||
Current 1A | ||
Pitch 2.54mm | ||
Voltage 250 V ac/dc | ||
Row Width 7.62mm | ||
Frame Type Ladder | ||
Contact Plating Tin | ||
Orientation Vertical | ||
Minimum Operating Temperature -40°C | ||
Termination Type Solder | ||
Maximum Operating Temperature 105°C | ||
Depth 5.1mm | ||
Width 10 mm | ||
Standards/Approvals No | ||
Length 7.62mm | ||
Housing Material Polybutylene Terephthalate | ||
Contact Material Phosphor Bronze | ||
Our large selection of DIP sockets ranging from 6 to 48 contacts provides a highly reliable connection between your integrated circuit (IC) devices and PCBs. Termination options include through hole and surface mounting, four-finger and dual leaf contacts, as well as a variety of plating options.
6 to 48 positions
Precision four-finger inner contacts or dual
Leaf contacts are optional
Open frame and closed frame housings
End-to-end and side-to-side stackable
Available with a variety of plating options
Quick IC mating/unmating
Easy field IC replacement
Avoidance of IC overheating during soldering
Flexibility of system upgrade
Large portfolio offers product closest to your need
Applications
Industrial controls
Intelligent buildings
Medical devices
Military
Other embedded systems
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