Bergquist 2200SF Series Self-Adhesive Thermal Gap Pad, 0.125 in Thick, 2 W/mK, 16 in, 8in, Timber
- RS 제품 번호:
- 282-6755
- 제조사 부품 번호:
- GAP PAD TGP 2200SF, 16in x 8in x 0.125 sh
- 제조업체:
- Bergquist
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- RS 제품 번호:
- 282-6755
- 제조사 부품 번호:
- GAP PAD TGP 2200SF, 16in x 8in x 0.125 sh
- 제조업체:
- Bergquist
사양
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제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 0.125in | |
| Thermal Conductivity | 2W/mK | |
| Self-Adhesive | Yes | |
| Conductive Material | Timber | |
| Length | 16in | |
| Standards/Approvals | No | |
| Width | 8in | |
| Series | 2200SF | |
| 모두 선택 | ||
|---|---|---|
브랜드 Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 0.125in | ||
Thermal Conductivity 2W/mK | ||
Self-Adhesive Yes | ||
Conductive Material Timber | ||
Length 16in | ||
Standards/Approvals No | ||
Width 8in | ||
Series 2200SF | ||
제외
The Bergquist Silicone-Free Formulation, High Performance Thermally Conductive Material. It is a high performance, 2.0 W/m-K, thermally conductive gap filling material. The compound is silicone free by design and offers exceptionally low interfacial resistances to adjacent surfaces.
Silicone-free formulation
Minimal compression set
0.5 mil film provides tack free surface
Tacky side allows for ease of handling and placement
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