Bergquist TGP 2000 Series Self-Adhesive Thermal Gap Pad, 0.08 in Thick, 2 W/mK, 16 in, 8in, Silicone
- RS 제품 번호:
- 282-6745
- 제조사 부품 번호:
- GAP PAD TGP 2000, 16in x 8in x 0.08 sh
- 제조업체:
- Bergquist
Subtotal (1 unit)*
₩275,774.00
일시적 품절
- 2026년 12월 16일 부터 배송
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수량 | 한팩당 |
|---|---|
| 1 + | ₩275,774.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 282-6745
- 제조사 부품 번호:
- GAP PAD TGP 2000, 16in x 8in x 0.08 sh
- 제조업체:
- Bergquist
사양
참조 문서
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Bergquist | |
| Product Type | Thermal Gap Pad | |
| Thickness | 0.08in | |
| Thermal Conductivity | 2W/mK | |
| Self-Adhesive | Yes | |
| Trade Name | TGP 2000 | |
| Conductive Material | Silicone | |
| Width | 8in | |
| Standards/Approvals | No | |
| Length | 16in | |
| Series | TGP 2000 | |
| 모두 선택 | ||
|---|---|---|
브랜드 Bergquist | ||
Product Type Thermal Gap Pad | ||
Thickness 0.08in | ||
Thermal Conductivity 2W/mK | ||
Self-Adhesive Yes | ||
Trade Name TGP 2000 | ||
Conductive Material Silicone | ||
Width 8in | ||
Standards/Approvals No | ||
Length 16in | ||
Series TGP 2000 | ||
제외
- COO (Country of Origin):
- US
The Bergquist Highly Conformable, Thermally Conductive, Reinforced S-Class Gap Filling Material. It is recommended for low-stress applications that require a mid to high thermally conductive interface material. The highly conformable nature of the material allows the pad to fill in air voids and air gaps between PC boards and heat sinks or metal chassis with stepped topography, rough surfaces and high stack-up tolerances.
Highly Conformable
Low hardness
Designed for low-stress applications
Fiberglass reinforced for puncture, shear and tear resistance
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