TE Connectivity 3250 10Ω, 2512 (6432M) Thick Film SMD Resistor ±5% 1W

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Subtotal (1 Box of 1000 units)*

₩101,400.00

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RS 제품 번호:
168-0191
제조사 부품 번호:
352010RJT
제조업체:
TE Connectivity
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TE Connectivity

COO (Country of Origin):
TH

TE Connectivity 3520 Series SMD Fixed Resistors


This range of SMD fixed resistors come from the TE Connectivity 3520 series. They are all house in a 3520 industry standard package size and are low profile high power resistors featuring a small size to power ratio. The 3520 devices range from 1 ohm to 10M and tolerances of 1% and 5%. They also include zero ohm links.

Type 3520 thick film resistors are powerful devices within a Compact package. They are perfect for industrial applications and general purpose use. Example applications include; high frequency operation, owing to the short lead structure and low capacitance.

Features and Benefits

• This thick film series comes in a variety of resistance ranging from 1 Ω to 1 MΩ.

• Terminal finish: Matte Sn

• Moisture sensitivity level: Level 2

• Working to an operating temperature of -55°C to +125 °C

• Pack size: 3520

Construction

Precious metal terminations are printed on to a ceramic base and fired. The resistive element is then screen printed and the passivation layer added. The resistor is trimmed to tolerance by a laser. The Prescribed Tile is broken into strips, the end plating is fired and the strips broken into individual components. Final termination is MADE by electroplating

FAQ’s

What is MSL? (Moisture Sensitivity Level)

Moisture sensitivity level relates to the handling and packaging precautions on semiconductors and passive components.

Moisture sensitivity level: Level 2 (1 year <+30/60%)

Handling Recommendations

When flow soldering - the land width must be smaller than the Chip Resistor width to properly control the solder application. Generally, the land width can be Chip Resistor width (W) x 0.7 to 0.8. When reflow soldering – solder application amount can be adjusted. Thus the land width can be set to W x 1.0 to 1.3.

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