TE Connectivity NEOHM SMA-Q 274 kΩ, 0204 Thin Film Surface Mount Resistor 1 % Surface 0.4 W - SMA-Q0204FTDX274K

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Subtotal (1 reel of 3000 units)*

₩175,500.00

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  • 2026년 11월 16일 부터 배송
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3000 - 12000₩58.50₩178,425.00
15000 +₩58.50₩174,915.00

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RS 제품 번호:
590-368
제조사 부품 번호:
SMA-Q0204FTDX274K
제조업체:
TE Connectivity
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브랜드

TE Connectivity

Resistance

274kΩ

Product Type

Surface Mount Resistor

Resistor Type

Metal Film

Technology

Thin Film

Package/Case

0204

Packaging

Tape & Reel

Tolerance

1 %

Power Rating

0.4W

Voltage

20V

Temperature Coefficient

±50 ppm/°C

Mount Type

Surface

Automotive Standard

AEC-Q200

Series

NEOHM SMA-Q

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

155°C

Standards/Approvals

AEC-Q200, IEC 60115-1, JIS-C-5201-1, MIL-STD-202, RoHS, UL-94 V-0/V-1

Width

1.40mm

Length

3.50mm

COO (Country of Origin):
TW
The TE Connectivity Metal film precision MELF resistor designed specifically for stringent automotive applications. With its SMD-enabled structure, this resistor provides exceptional stability and reliability over a broad temperature range, making it ideal for diverse environments. AEC-Q200 qualified, it boasts a low temperature coefficient and tight tolerance, ensuring precision in performance and minimal drift during operation. This lead-free and RoHS compliant component is built to withstand moisture with an improved coating, enhancing durability and longevity. It comes in multiple sizes and power ratings, tailored to fulfil various application requirements in automotive, industrial, and telecommunication sectors.

AEC Q200 qualification ensures compliance with rigorous automotive standards

Low TCR guarantees consistent performance across varying temperatures

Moisture sensitivity level MSL1 provides enhanced protection against humidity

SMD enabled design allows for efficient surface mounting

Thin film technology contributes to high accuracy and stability

Lead free and RoHS compliant, aligning with environmental regulations

Durable insulation coating protects against environmental factors

Sn termination on the Ni barrier layer improves solderability

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