TE Connectivity NEOHM SMA-Q 174 kΩ, 0204 Thin Film Surface Mount Resistor 0.1 % Surface 0.4 W - SMA-Q0204BTCX174K

Subtotal (1 reel of 3000 units)*

₩1,332,000.00

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  • 2026년 12월 24일 부터 배송
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RS 제품 번호:
590-314
제조사 부품 번호:
SMA-Q0204BTCX174K
제조업체:
TE Connectivity
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브랜드

TE Connectivity

Product Type

Surface Mount Resistor

Resistance

174kΩ

Resistor Type

Metal Film Precision

Technology

Thin Film

Package/Case

0204

Packaging

Tape & Reel

Tolerance

0.1 %

Voltage

20V

Power Rating

0.4W

Mount Type

Surface

Temperature Coefficient

±25 ppm/°C

Automotive Standard

AEC-Q200

Series

NEOHM SMA-Q

Minimum Operating Temperature

-55°C

Maximum Operating Temperature

155°C

Standards/Approvals

Lead-Free, RoHS

Length

3.5mm

Width

2.20mm

COO (Country of Origin):
TW
The TE Connectivity Metal film precision MELF resistor represents a significant advancement in SMD technology tailored for high-performance applications. Designed with a robust construction and AEC-Q200 qualification, this resistor ensures reliability and allows for tight tolerances and low temperature coefficients for optimal precision. It is particularly well-suited for electronic devices in automotive, industrial, and telecommunications sectors, ensuring consistent performance even in the most demanding environments. The enhanced coating provides superior humidity protection, making it ideal for applications with significant moisture exposure. The It excels in delivering high power ratings and stability, making it an exceptional choice for reliable circuitry.

Developed for surface mount technology applications to simplify assembly processes

Provides a high degree of stability under various environmental conditions

Engineered for automotive and industrial applications which require robustness

Showcases a low temperature coefficient, enhancing long term precision

Supports a wide range of resistance values, catering to diverse circuit designs

Meets stringent RoHS compliance standards, ensuring eco friendliness

Includes sn termination on the Ni barrier layer for improved solderability

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