Murata, LQW, 1608 Unshielded Wirewound Surface Mount Inductor with a Non-Magnetic Ceramic Core, 0.018 μH ±2 % 550 mA Idc
- RS 제품 번호:
- 169-2780
- 제조사 부품 번호:
- LQW18AN18NG00D
- 제조업체:
- Murata
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- RS 제품 번호:
- 169-2780
- 제조사 부품 번호:
- LQW18AN18NG00D
- 제조업체:
- Murata
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Murata | |
| Inductance | 0.018 μH | |
| Product Type | Wirewound Surface Mount Inductor | |
| Maximum DC Current | 550mA | |
| Package/Case | 1608 | |
| Packaging | Paper Tape | |
| Length | 1.6mm | |
| Automotive Standard | No | |
| Shielding | No | |
| Maximum DC Resistance | 160mΩ | |
| Minimum Operating Temperature | -55°C | |
| Pin Count | 2 | |
| Inductance Tolerance | ±2 % | |
| Series | LQW | |
| Maximum Operating Temperature | 125°C | |
| Core Material | Non-Magnetic Ceramic | |
| Standards/Approvals | RoHS | |
| Termination Style | Solder | |
| Depth | 0.8mm | |
| Height | 0.8mm | |
| Maximum Self Resonant Frequency | 5500MHz | |
| Minimum Quality Factor | 40 | |
| Moulded | Yes | |
| Inductor Construction | Wirewound | |
| 모두 선택 | ||
|---|---|---|
브랜드 Murata | ||
Inductance 0.018 μH | ||
Product Type Wirewound Surface Mount Inductor | ||
Maximum DC Current 550mA | ||
Package/Case 1608 | ||
Packaging Paper Tape | ||
Length 1.6mm | ||
Automotive Standard No | ||
Shielding No | ||
Maximum DC Resistance 160mΩ | ||
Minimum Operating Temperature -55°C | ||
Pin Count 2 | ||
Inductance Tolerance ±2 % | ||
Series LQW | ||
Maximum Operating Temperature 125°C | ||
Core Material Non-Magnetic Ceramic | ||
Standards/Approvals RoHS | ||
Termination Style Solder | ||
Depth 0.8mm | ||
Height 0.8mm | ||
Maximum Self Resonant Frequency 5500MHz | ||
Minimum Quality Factor 40 | ||
Moulded Yes | ||
Inductor Construction Wirewound | ||
Murata 0603 LQW18AN Series Wire Wound Inductors
High quality Coil inductors designed for VHF and UHF applications.
High resonance frequency.
Low tolerance of inductance values.
Models with the suffix '10D' have lower DC resistance values.
Applications: High frequency circuits for wireless telecommunications equipment: Bluetooth, GSM, W-LAN.
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