Wurth Elektronik, WE-CBF, 0603 Shielded Multilayer Surface Mount Inductor with a Ferrite Core, Multilayer 200 mA Idc

RS 제품 번호:: 144-9794
제조사 부품 번호:: 74279266
제조업체:: Wurth Elektronik

Wurth Elektronik, WE-CBF, 0603 Shielded Multilayer Surface Mount Inductor with a Ferrite Core, Multilayer 200 mA Idc

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Subtotal (1 reel of 4000 units)*

₩600,000.00

4,000 개 단위 배송 준비 완료

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수량	한팩당	릴당*
4000 - 16000	₩150.00	₩599,200.00
20000 +	₩134.00	₩539,200.00

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:: 144-9794
제조사 부품 번호:: 74279266
제조업체:: Wurth Elektronik

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모두 선택	제품 정보	값
	브랜드	Wurth Elektronik
	Product Type	Multilayer Surface Mount Inductor
	Maximum DC Current	200mA
	Package/Case	0603
	Length	1.6mm
	Packaging	Tape & Reel
	Automotive Standard	No
	Shielding	Yes
	Minimum Operating Temperature	-55°C
	Pin Count	2
	Maximum DC Resistance	600mΩ
	Maximum Operating Temperature	125°C
	Series	WE-CBF
	Height	800μm
	Depth	800μm
	Termination Style	Surface Mount
	Standards/Approvals	IEC 60286-3:2013
	Core Material	Ferrite
	Moulded	Yes
	Inductor Construction	Multilayer

	모두 선택
	브랜드 Wurth Elektronik
	Product Type Multilayer Surface Mount Inductor
	Maximum DC Current 200mA
	Package/Case 0603
	Length 1.6mm
	Packaging Tape & Reel
	Automotive Standard No
	Shielding Yes
	Minimum Operating Temperature -55°C
	Pin Count 2
	Maximum DC Resistance 600mΩ
	Maximum Operating Temperature 125°C
	Series WE-CBF
	Height 800μm
	Depth 800μm
	Termination Style Surface Mount
	Standards/Approvals IEC 60286-3:2013
	Core Material Ferrite
	Moulded Yes
	Inductor Construction Multilayer

COO (Country of Origin):: TW

Wurth Elektronik WE-CBF Series Multilayer Surface Mount Inductor, 200mA Maximum DC Current, 600mΩ Maximum DC Resistance - 74279266

This multilayer surface-mount inductor provides low-current magnetic filtering in Compact SMD assemblies and operates across a wide temperature range. It is a moulded, shielded ferrite component designed for placement on printed circuit boards using tape-and-reel packaging, suitable for applications requiring a small footprint and stable performance under thermal stress.

Features and Benefits:

• Up to 200mA current rating enables low-current signal filtering
• 600mΩ RDC limits voltage drop in low-power circuits
• Shielded construction reduces electromagnetic interference
• Ferrite core material improves inductance stability with temperature
• Tape-and-reel packaging supports automated placement

Applications

• Suitable for power‑line noise suppression in control modules
• Ideal for signal conditioning in Compact consumer electronics
• Used with precision analogue front‑ends requiring low leakage
• Can be used for EMI mitigation in communication interfaces

What mounting style does it use?

It is offered with surface-mount terminations for SMD assembly.

What package size should be planned for footprint design?

The component uses an 0603 package case intended for Compact board layouts.

How does it behave across temperature extremes?

It is specified to function between -55°C and 125°C for broad thermal operation.

Is the component moulded or an open construction?

The device is moulded and incorporates shielding for mechanical protection and EMI control.