Weller Wire, 1 mm Lead Free Solder, 217 °C Melting Point
- RS 제품 번호:
- 788-3723
- Distrelec 제품 번호:
- 110-64-779
- 제조사 부품 번호:
- T0051388699
- 제조업체:
- Weller
Subtotal (1 reel of 1 unit)*
₩134,440.00
재고있음
- 5 개 단위 배송 준비 완료
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릴당 | 릴당 |
|---|---|
| 1 + | ₩134,440.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 788-3723
- Distrelec 제품 번호:
- 110-64-779
- 제조사 부품 번호:
- T0051388699
- 제조업체:
- Weller
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Weller | |
| Product Type | Lead Free Solder | |
| Wire Diameter | 1mm | |
| Percent Lead | 0% | |
| Product Form | Wire | |
| Melting Point | 217°C | |
| Percent Silver | 3% | |
| Percent Tin | 96.5% | |
| Flux Type | Rosin | |
| Product Weight | 250g | |
| Percent Copper | 0.5% | |
| Standards/Approvals | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Weller | ||
Product Type Lead Free Solder | ||
Wire Diameter 1mm | ||
Percent Lead 0% | ||
Product Form Wire | ||
Melting Point 217°C | ||
Percent Silver 3% | ||
Percent Tin 96.5% | ||
Flux Type Rosin | ||
Product Weight 250g | ||
Percent Copper 0.5% | ||
Standards/Approvals No | ||
- COO (Country of Origin):
- JP
Weller Lead Free Solder, 1mm Wire Diameter, 250g Product Weight - T0051388699
This lead-free solder is a rosin-flux cored wire designed for Electronic Assembly and repair in industrial environments. It provides a reliable filler metal for joining electrical and electronic components where lead avoidance is required, and is supplied on a 250 g spool for workshop use.
Features and Benefits:
• 1mm wire diameter enables controlled feed in automated dispensers
• 96.5% tin composition ensures predictable wetting behaviour
• 3% silver content improves joint ductility and fatigue resistance
• 0.5% copper reduces whisker propensity and enhances mechanical strength
• 217 °C melting point allows consistent reflow across typical soldering irons
• Rosin flux core yields low-residue flux deposition after soldering
• 96.5% tin composition ensures predictable wetting behaviour
• 3% silver content improves joint ductility and fatigue resistance
• 0.5% copper reduces whisker propensity and enhances mechanical strength
• 217 °C melting point allows consistent reflow across typical soldering irons
• Rosin flux core yields low-residue flux deposition after soldering
Applications
• Suitable for hand soldering and automated wave or selective soldering
• Ideal for through-hole and SMT repairs on electronic assemblies
• Used for joining silver-bearing component leads in control systems
• Can be used for maintenance of electrical modules in automation equipment
• Ideal for through-hole and SMT repairs on electronic assemblies
• Used for joining silver-bearing component leads in control systems
• Can be used for maintenance of electrical modules in automation equipment
What spool weight should I expect for routine workshop stocking?
The product is supplied as a 250 g spool appropriate for small to medium repair batches.
How does the alloy composition affect thermal cycling performance?
The tin-rich alloy with 3% silver improves joint resilience under repeated temperature changes compared with pure-tin solders.
Is the flux type suitable for delicate electronics with minimal cleaning?
The rosin flux core produces low residues compatible with many electronics tasks where limited post-solder cleaning is performed.
What soldering temperature should be targeted to ensure proper joint formation?
Aim to heat the joint above the 217 °C melting point with sufficient thermal mass to wet pads and leads without prolonged dwell.
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