Weller Wire, 1 mm Lead Free Solder, 217 °C Melting Point

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₩134,440.00

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RS 제품 번호:
788-3723
Distrelec 제품 번호:
110-64-779
제조사 부품 번호:
T0051388699
제조업체:
Weller
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모두 선택

브랜드

Weller

Product Type

Lead Free Solder

Wire Diameter

1mm

Percent Lead

0%

Product Form

Wire

Melting Point

217°C

Percent Silver

3%

Percent Tin

96.5%

Flux Type

Rosin

Product Weight

250g

Percent Copper

0.5%

Standards/Approvals

No

COO (Country of Origin):
JP

Weller Lead Free Solder, 1mm Wire Diameter, 250g Product Weight - T0051388699


This lead-free solder is a rosin-flux cored wire designed for Electronic Assembly and repair in industrial environments. It provides a reliable filler metal for joining electrical and electronic components where lead avoidance is required, and is supplied on a 250 g spool for workshop use.

Features and Benefits:


• 1mm wire diameter enables controlled feed in automated dispensers
• 96.5% tin composition ensures predictable wetting behaviour
• 3% silver content improves joint ductility and fatigue resistance
• 0.5% copper reduces whisker propensity and enhances mechanical strength
• 217 °C melting point allows consistent reflow across typical soldering irons
• Rosin flux core yields low-residue flux deposition after soldering

Applications


• Suitable for hand soldering and automated wave or selective soldering
• Ideal for through-hole and SMT repairs on electronic assemblies
• Used for joining silver-bearing component leads in control systems
• Can be used for maintenance of electrical modules in automation equipment

What spool weight should I expect for routine workshop stocking?


The product is supplied as a 250 g spool appropriate for small to medium repair batches.

How does the alloy composition affect thermal cycling performance?


The tin-rich alloy with 3% silver improves joint resilience under repeated temperature changes compared with pure-tin solders.

Is the flux type suitable for delicate electronics with minimal cleaning?


The rosin flux core produces low residues compatible with many electronics tasks where limited post-solder cleaning is performed.

What soldering temperature should be targeted to ensure proper joint formation?


Aim to heat the joint above the 217 °C melting point with sufficient thermal mass to wet pads and leads without prolonged dwell.

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