Infineon 650 V 10 A Diode Schottky 10-Pin HDSOP
- RS 제품 번호:
- 216-8370
- 제조사 부품 번호:
- IDDD10G65C6XTMA1
- 제조업체:
- Infineon
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대량 구매 할인 기용 가능
Subtotal (1 reel of 1700 units)*
₩4,608,632.00
일시적 품절
- 2026년 3월 30일 부터 배송
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.
수량 | 한팩당 | 릴당* |
|---|---|---|
| 1700 - 1700 | ₩2,710.96 | ₩4,610,230.00 |
| 3400 - 5100 | ₩2,658.32 | ₩4,518,185.20 |
| 6800 + | ₩2,603.80 | ₩4,427,738.40 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 216-8370
- 제조사 부품 번호:
- IDDD10G65C6XTMA1
- 제조업체:
- Infineon
사양
참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Infineon | |
| Product Type | Diode | |
| Mount Type | Surface | |
| Package Type | HDSOP | |
| Maximum Continuous Forward Current If | 10A | |
| Peak Reverse Repetitive Voltage Vrrm | 650V | |
| Diode Configuration | Single | |
| Series | IDDD10G65C6 | |
| Rectifier Type | Schottky | |
| Pin Count | 10 | |
| Peak Non-Repetitive Forward Surge Current Ifsm | 600A | |
| Maximum Forward Voltage Vf | 1.25V | |
| Peak Reverse Current Ir | 77μA | |
| Minimum Operating Temperature | -55°C | |
| Maximum Operating Temperature | 175°C | |
| Height | 2.35mm | |
| Width | 15.6 mm | |
| Length | 6.6mm | |
| Standards/Approvals | JEDEC (J-STD20 and JESD22) | |
| Automotive Standard | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Infineon | ||
Product Type Diode | ||
Mount Type Surface | ||
Package Type HDSOP | ||
Maximum Continuous Forward Current If 10A | ||
Peak Reverse Repetitive Voltage Vrrm 650V | ||
Diode Configuration Single | ||
Series IDDD10G65C6 | ||
Rectifier Type Schottky | ||
Pin Count 10 | ||
Peak Non-Repetitive Forward Surge Current Ifsm 600A | ||
Maximum Forward Voltage Vf 1.25V | ||
Peak Reverse Current Ir 77μA | ||
Minimum Operating Temperature -55°C | ||
Maximum Operating Temperature 175°C | ||
Height 2.35mm | ||
Width 15.6 mm | ||
Length 6.6mm | ||
Standards/Approvals JEDEC (J-STD20 and JESD22) | ||
Automotive Standard No | ||
The Infineon IDD series schottky diode introduces double DPAK (DDPAK), the first top-side cooled surface mount device package addressing high power SMPS applications such as PC power, solar, server and telecom. It has current rating of 10 A. It provides a system solution for high current hard switching topologies such as PFC and a high-end efficiency solution for LLC topologies.
Enabling highest energy efficiency
Thermal decoupling of board and semiconductor allows to overcome thermal PCB limits
Reduced parasitic source inductance improves efficiency and ease-of-use
Enables higher power density solutions
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