Ezurio 453-00222-K1 RF Module Pulse Width Modulation (MCPWM) 2.48 GHz 3.63 V
- RS 제품 번호:
- 331-744
- 제조사 부품 번호:
- 453-00222-K1
- 제조업체:
- Ezurio
대량 구매 할인 기용 가능
Subtotal (1 unit)*
₩109,773.20
재고있음
- 10 개 단위 배송 준비 완료
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수량 | 한팩당 |
|---|---|
| 1 - 9 | ₩109,773.20 |
| 10 + | ₩98,794.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 331-744
- 제조사 부품 번호:
- 453-00222-K1
- 제조업체:
- Ezurio
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Ezurio | |
| Product Type | RF Module | |
| Component Type | Temperature Sensor | |
| Modulation Technique | Pulse Width Modulation (MCPWM) | |
| Maximum RF Data Rate | 54Mbps | |
| Maximum Output Power | 17.5dBm | |
| Frequency | 2.48GHz | |
| Receiver Sensitivity | -95dBm | |
| Interface Type | UART, SDIO, SPI | |
| Minimum Supply Voltage | 1.71V | |
| Maximum Supply Voltage | 3.63V | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 85°C | |
| Standards/Approvals | IC/ISED, EN 300 328 v2.2.2, FCC, MIC | |
| Series | SL917 | |
| Width | 21.1 mm | |
| Length | 16mm | |
| Height | 2.3mm | |
| 모두 선택 | ||
|---|---|---|
브랜드 Ezurio | ||
Product Type RF Module | ||
Component Type Temperature Sensor | ||
Modulation Technique Pulse Width Modulation (MCPWM) | ||
Maximum RF Data Rate 54Mbps | ||
Maximum Output Power 17.5dBm | ||
Frequency 2.48GHz | ||
Receiver Sensitivity -95dBm | ||
Interface Type UART, SDIO, SPI | ||
Minimum Supply Voltage 1.71V | ||
Maximum Supply Voltage 3.63V | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 85°C | ||
Standards/Approvals IC/ISED, EN 300 328 v2.2.2, FCC, MIC | ||
Series SL917 | ||
Width 21.1 mm | ||
Length 16mm | ||
Height 2.3mm | ||
- COO (Country of Origin):
- CN
The Ezurio SL917 module is a lowest power Wi-Fi 6 plus Bluetooth LE 5.4, ideal for ultra low power IoT wireless devices using Wi-Fi, Bluetooth, Matter, and IP networking for secure cloud connectivity. It is optimal for developing battery operated devices that need long battery life. The SL917 SoC module include an ultra-low power Wi-Fi 6 plus Bluetooth Low Energy 5.4 wireless CPU subsystem, and an integrated micro-controller application subsystem, security, peripherals and power management sub system all in a single 16 x 21.1 x 2.3 mm package.
Bluetooth LE 5.4
Single chip matter over Wi-Fi solution
Best in Class device and wireless security
WLAN Tx power up to +17.5 dBm with integrated PA
Bluetooth LE Tx power up to +17 dBm with integrated PA
WLAN Rx sensitivity as low as -95 dBm
Ultra low power sensor hub peripherals
Matrix vector processor
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