BGA725L6E6327FTSA1 Infineon RF Amplifier Low Noise 20 dB, 6-Pin 1615MHz TSLP

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Subtotal (1 pack of 10 units)*

₩5,080.00

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한팩당
한팩당*
10 - 10₩508.00₩5,080.00
20 - 90₩482.00₩4,820.00
100 - 240₩454.00₩4,540.00
250 - 490₩422.00₩4,220.00
500 +₩388.00₩3,880.00

* 참고 가격: 실제 구매가격과 다를 수 있습니다

포장 옵션
RS 제품 번호:
258-0663
제조사 부품 번호:
BGA725L6E6327FTSA1
제조업체:
Infineon
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브랜드

Infineon

Product Type

RF Amplifier

Operating Frequency

1615MHz

Amplifier Type

Low Noise

Technology

Silicon Germanium

Mount Type

Surface

Gain

20dB

Minimum Supply Voltage

1.5V

Package Type

TSLP

Pin Count

6

Maximum Supply Voltage

3.6V

Minimum Operating Temperature

-40°C

Noise Figure

0.65dB

P1dB - Compression Point

72mW

Third Order Intercept OIP3

-5dBm

Maximum Operating Temperature

85°C

Standards/Approvals

RoHS

Series

BGA

Automotive Standard

No

Infineon BGA Series RF Amplifier, 20dB Gain, 1615MHz Operating Frequency - BGA725L6E6327FTSA1


This RF amplifier is a low-noise silicon-germanium device designed for surface-mount applications operating around 1615MHz. It amplifies weak signals while functioning across a broad supply range and is suited to systems requiring Compact packaged radio-frequency gain in commercial temperature environments.

Features and Benefits:


• 20dB gain improves weak-signal reception and link margin
• 0.65dB noise figure reduces added system noise floor
• 1.5V to 3.6V supply range enables flexible powering options
• P1dB 72 mW output prevents early saturation under drive
• OIP3 -5 dBm linearity preserves signal fidelity at high levels

Applications


• Suitable for front-end receiver stages in RF modules
• Ideal for satellite communication downlink receivers
• Used with surface-mount transceiver assemblies on Compact boards
• Can be used for signal conditioning in telemetry links
• Applicable to gain stages in wireless infrastructure equipment

What thermal limits should be considered for operation?


The device operates between -40°C and 85°C, so thermal management should maintain junction temperature within this range.

How many connections are required on the PCB footprint?


The component uses a 6‑pin surface-mount package, requiring six solder pads for electrical and mechanical attachment.

What fabrication technology defines its semiconductor behaviour?


It employs silicon-germanium technology, which provides RF performance characteristics suitable for low-noise amplification.

Is the product compliant with environmental material standards?


It meets RoHS requirements restricting certain hazardous substances in electronic assemblies.

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