Loctite Loctite HF212 97SC DAP Lead Free Solder Paste, 500g Tub
- RS 제품 번호:
- 832-9750
- 제조사 부품 번호:
- 1791137
- 제조업체:
- Loctite
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RS는 더 이상 이 제품을 입고하지 않습니다.
- RS 제품 번호:
- 832-9750
- 제조사 부품 번호:
- 1791137
- 제조업체:
- Loctite
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Loctite | |
| Lead Free | Yes | |
| Trade Name | Loctite HF212 97SC DAP | |
| Package Type | Tub | |
| Package Size | 500g | |
| 모두 선택 | ||
|---|---|---|
브랜드 Loctite | ||
Lead Free Yes | ||
Trade Name Loctite HF212 97SC DAP | ||
Package Type Tub | ||
Package Size 500g | ||
HF 212 Solder Paste
LOCTITE HF 212 is a halogen-free solder paste that withstands the thermal demands inherent with larger assemblies. High reliability and a wide reflow process window are at the foundation of this material, ensuring its outstanding performance for the most demanding high value PCB applications.
LOCTITE HF 212 is a halogen-free, no clean, low voiding Pb-free solder paste
Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC
Suitable for high speed printing up to 150 mm/s
Solderable on challenging surface finishes (CuNiZn and Copper OSP)
Colorless residues for easy post-reflow inspection
RS 832-9750: HF 212 solder paste 97SC DAP
RS 832-9769: HF 212 solder paste 90iSC DAP
RS 832-9762: HF 212 solder paste 90iSC AGS
RS 832-9766: HF 212 solder paste 97SC AGS
RS 832-9775: HF 212 solder paste SAC0307 AGS
Is suitable for use with industry standard SAC ,high reliability SAC and low silver alloys SAC
Suitable for high speed printing up to 150 mm/s
Solderable on challenging surface finishes (CuNiZn and Copper OSP)
Colorless residues for easy post-reflow inspection
RS 832-9750: HF 212 solder paste 97SC DAP
RS 832-9769: HF 212 solder paste 90iSC DAP
RS 832-9762: HF 212 solder paste 90iSC AGS
RS 832-9766: HF 212 solder paste 97SC AGS
RS 832-9775: HF 212 solder paste SAC0307 AGS
Application
Designed for printing, pin-in-paste and enclosed head print capability
Excellent wetting to a broad range of metallization
Compatible with existing halogen-free solutions
Suitable for medium to large board assemblies
Excellent wetting to a broad range of metallization
Compatible with existing halogen-free solutions
Suitable for medium to large board assemblies
Solder Paste - Lead Free
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