Vishay SIP32434BDN-T1E4 High Side 1, Load Switch Power Switch IC 10-Pin, DFN-10
- RS 제품 번호:
- 240-5289
- 제조사 부품 번호:
- SIP32434BDN-T1E4
- 제조업체:
- Vishay
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대량 구매 할인 기용 가능
View bulk pricing optionsSubtotal (1 pack of 10 units)*
₩16,660.00
재고있음
- 5,510 개 단위 배송 준비 완료
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.
수량 | 한팩당 | 한팩당* |
|---|---|---|
| 10 - 40 | ₩1,666.00 | ₩16,660.00 |
| 50 - 90 | ₩1,638.00 | ₩16,380.00 |
| 100 - 240 | ₩1,606.00 | ₩16,060.00 |
| 250 - 990 | ₩1,578.00 | ₩15,780.00 |
| 1000 + | ₩1,548.00 | ₩15,480.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 240-5289
- 제조사 부품 번호:
- SIP32434BDN-T1E4
- 제조업체:
- Vishay
사양
참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Vishay | |
| Power Switch Topology | High Side | |
| Power Switch Type | Load Switch | |
| Product Type | Power Switch IC | |
| Switch On Resistance RdsOn | 33mΩ | |
| Number of Inputs | 1 | |
| Mount Type | Surface | |
| Minimum Supply Voltage | 2.8V | |
| Package Type | DFN-10 | |
| Pin Count | 10 | |
| Maximum Supply Voltage | 23V | |
| Minimum Operating Temperature | -40°C | |
| Operating Current | 6A | |
| Maximum Operating Temperature | 150°C | |
| Length | 3mm | |
| Standards/Approvals | No | |
| Series | SiP32434 | |
| Automotive Standard | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Vishay | ||
Power Switch Topology High Side | ||
Power Switch Type Load Switch | ||
Product Type Power Switch IC | ||
Switch On Resistance RdsOn 33mΩ | ||
Number of Inputs 1 | ||
Mount Type Surface | ||
Minimum Supply Voltage 2.8V | ||
Package Type DFN-10 | ||
Pin Count 10 | ||
Maximum Supply Voltage 23V | ||
Minimum Operating Temperature -40°C | ||
Operating Current 6A | ||
Maximum Operating Temperature 150°C | ||
Length 3mm | ||
Standards/Approvals No | ||
Series SiP32434 | ||
Automotive Standard No | ||
Vishay SiP32434 Series Power Switch IC, 6A Operating Current, 23V Maximum Supply Voltage - SIP32434BDN-T1E4
This power switch IC is a compact high‑side load switch designed to manage multiple outputs from a single input in low‑ to mid‑voltage systems. It functions as a multi‑channel power distribution device for electronic assemblies where controlled sequencing and protection of several rails is required. The component is packaged for surface‑mount assembly and is intended for applications demanding concentrated switching capability in a small footprint.
Features and Benefits:
• Low conduction loss with 33mΩ Rds(on) for efficient operation
• Supports up to 6A total operating current for higher load demands
• Accepts supply voltages from 2.8V to 23V for broad voltage compatibility
• Contains five independently controlled outputs to simplify power routing
• Ten‑pin DFN package enables space‑saving surface‑mount integration
• Rated to 150°C maximum operating temperature for elevated thermal conditions
• Supports up to 6A total operating current for higher load demands
• Accepts supply voltages from 2.8V to 23V for broad voltage compatibility
• Contains five independently controlled outputs to simplify power routing
• Ten‑pin DFN package enables space‑saving surface‑mount integration
• Rated to 150°C maximum operating temperature for elevated thermal conditions
Applications
• Suitable for powering multiple peripheral rails on handheld devices
• Ideal for centralised power distribution in industrial modules
• Used with battery management systems requiring multi‑output sequencing
• Can be used for sequencing power to sensors and communication ICs
• Suitable for compact assemblies where board space is limited
• Ideal for centralised power distribution in industrial modules
• Used with battery management systems requiring multi‑output sequencing
• Can be used for sequencing power to sensors and communication ICs
• Suitable for compact assemblies where board space is limited
What input arrangement does it use to feed multiple outputs?
It employs a single input channel that supplies five output switches, enabling one‑source distribution to several loads.
How does the package support PCB assembly and thermal performance?
The component is supplied in a 10‑pin DFN surface‑mount package that facilitates low‑profile placement and improved thermal conduction to the board.
What environmental limits should designers consider for reliability?
The device is rated to operate between -40°C and 150°C, which should be considered when specifying cooling and enclosure conditions.
Can it handle continuous heavy current in compact designs?
With a 6A operating current rating and a low Rds(on) of 33mΩ, it is suitable for sustained higher‑current loads within its thermal limits.
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