RND, 5.08mm Pitch, RND 205, 3 Way, , Pluggable Terminal Block, Pin Header, Through Hole, RND 205-2EDGVC-5.08-03P
- RS 재고 번호:
- 697-273
- 제조 부품 번호:
- RND 205-2EDGVC-5.08-03P
- 제조업체:
- RND
N
Subtotal (1 pack of 100 units)*
₩10,941.60
일시적 품절
- 2026년 2월 19일 부터 배송
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팩 | 한팩당 | 한팩당* |
|---|---|---|
| 1 + | ₩10,941.60 | ₩109.04 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 재고 번호:
- 697-273
- 제조 부품 번호:
- RND 205-2EDGVC-5.08-03P
- 제조업체:
- RND
사양
기술적 참조
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | RND | |
| Pluggable Terminal Block Type | Pin Header | |
| Number of Contacts | 3 | |
| Pitch | 5.08mm | |
| Series | RND 205 | |
| Number of Rows | 1 | |
| Body Orientation | Straight | |
| Mounting Type | Through Hole | |
| 모두 선택 | ||
|---|---|---|
브랜드 RND | ||
Pluggable Terminal Block Type Pin Header | ||
Number of Contacts 3 | ||
Pitch 5.08mm | ||
Series RND 205 | ||
Number of Rows 1 | ||
Body Orientation Straight | ||
Mounting Type Through Hole | ||
- COO (Country of Origin):
- CN
The RND Pin header offers a reliable and robust connection solution for various electronic applications. Manufactured with high-quality brass and tin plating, it ensures durability and excellent conductivity, making it suitable for demanding environments. The innovative design meets IEC standards, accommodating a wide range of rated voltages and currents while maintaining safety and performance. With a temperature range of -40°C to +105°C, this product is adept at handling extreme conditions, providing versatility in usage. The compact size and pitch of the product are ideal for space-constrained designs, while its ease of soldering allows for quick assembly.
Capable of handling high voltages with confidence
A wide temperature tolerance, ideal for diverse applications
Compact pitch size fits well in space-limited projects
Easy to solder, promoting quicker assembly processes
Provides reliable connection stability in various environments
A wide temperature tolerance, ideal for diverse applications
Compact pitch size fits well in space-limited projects
Easy to solder, promoting quicker assembly processes
Provides reliable connection stability in various environments
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