Molex Pluggable I/O Connector ZSFP+ I/O Connector Female Pin 16 Port 320-Position, 172501-8002
- RS 제품 번호:
- 683-585
- 제조사 부품 번호:
- 172501-8002
- 제조업체:
- Molex
Subtotal (1 tray of 2 units)*
₩479,349.00
제조사가 재고 비축중
- 2026년 7월 03일 부터 배송 준비 완료
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Tray(s) | Per Tray | 한팩당* |
|---|---|---|
| 1 + | ₩479,349.00 | ₩239,674.50 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 683-585
- 제조사 부품 번호:
- 172501-8002
- 제조업체:
- Molex
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Termination Type | Pin | |
| Sub Type | I/O Connector | |
| Product Type | Pluggable I/O Connector | |
| Form Factor | ZSFP+ | |
| Number of Ports | 16 | |
| Current | 0.5A | |
| Orientation | Right Angle | |
| Number of Contacts | 320 | |
| Connector Gender | Female | |
| Contact Material | High Performance Alloy | |
| Contact Plating | Gold, Matte Tin | |
| Voltage | 30Vrms | |
| Housing Material | Copper Alloy | |
| Series | 172501 | |
| Contact Gender | Female | |
| Standards/Approvals | UL Certification: E29179, IEC-62474, IPC 1752A Class C & D, REACH, RoHS, CHINA RoHS | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Termination Type Pin | ||
Sub Type I/O Connector | ||
Product Type Pluggable I/O Connector | ||
Form Factor ZSFP+ | ||
Number of Ports 16 | ||
Current 0.5A | ||
Orientation Right Angle | ||
Number of Contacts 320 | ||
Connector Gender Female | ||
Contact Material High Performance Alloy | ||
Contact Plating Gold, Matte Tin | ||
Voltage 30Vrms | ||
Housing Material Copper Alloy | ||
Series 172501 | ||
Contact Gender Female | ||
Standards/Approvals UL Certification: E29179, IEC-62474, IPC 1752A Class C & D, REACH, RoHS, CHINA RoHS | ||
- COO (Country of Origin):
- ID
The Molex zSFP+ Stacked Ganged Assembly with Metal Spring Fingers is expertly designed for high-speed I/O connector applications featuring a compact two-by-eight configuration that optimises airflow. This product effectively accommodates 320 circuits making it ideal for advanced electronic integration. With its robust construction that includes a high-performance alloy and thermoplastic materials this assembly ensures reliable performance across a broad operating temperature range of -40° to +85°C. The unique engineering incorporates EMI shielding to enhance data integrity while maintaining a maximum data rate of 28.0 Gbps. Accurately tailored for module to board applications this versatile receptacle guarantees ease of installation and secure connectivity.
320 circuits for enhanced connection capacity
Engineered for module to board applications providing flexibility
Includes EMI fingers for superior shielding performance
Constructed with high-performance thermoplastic and alloy materials for durability
Right angle orientation simplifies installation in compact spaces
Designed to withstand 100 mating cycles which ensuring long-term usability
PCB retention features enhance stability in electronic assemblies
Tray packaging facilitates easy handling and minimises damage during transit
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