Phoenix Contact PTSM Series PCB Terminal Block, 5-Contact, 2.5mm Pitch, Solder Mount, 1-Row, Push In Spring Termination
- RS 제품 번호:
- 638-328
- 제조사 부품 번호:
- 1814731
- 제조업체:
- Phoenix Contact
N
Subtotal (1 pack of 400 units)*
₩978,746.80
일시적 품절
- 2026년 4월 08일 부터 배송
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팩 | 한팩당 | 한팩당* |
|---|---|---|
| 1 + | ₩978,746.80 | ₩2,447.76 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 638-328
- 제조사 부품 번호:
- 1814731
- 제조업체:
- Phoenix Contact
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Phoenix Contact | |
| Number of Contacts | 5 | |
| Pitch | 2.5mm | |
| Number of Rows | 1 | |
| Mounting Type | Solder Mount | |
| Gender | Female | |
| Termination Method | Push In Spring | |
| Series | PTSM | |
| 모두 선택 | ||
|---|---|---|
브랜드 Phoenix Contact | ||
Number of Contacts 5 | ||
Pitch 2.5mm | ||
Number of Rows 1 | ||
Mounting Type Solder Mount | ||
Gender Female | ||
Termination Method Push In Spring | ||
Series PTSM | ||
- COO (Country of Origin):
- IN
The Phoenix Contact PCB terminal block designed specifically for electronic applications requiring reliability and efficiency. With a sleek signal white design, this terminal block facilitates seamless integration into Surface Mount Technology (SMT) processes, ensuring superior performance across a variety of applications. Engineered for high current carrying capacity, it offers a nominal current of 6 A, while its compact dimensions enable efficient use of space on printed circuit boards. The push-in spring connection method simplifies conductor insertion, eliminating the need for additional tools and promoting fast, secure connections.
Defined contact force maintains stable connections over time
Vertical connections enable multi row arrangements on PCBs
Extended performance range for various conductor sizes
Environmental compliance ensures safety for sustainable applications
Vertical connections enable multi row arrangements on PCBs
Extended performance range for various conductor sizes
Environmental compliance ensures safety for sustainable applications
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