Amphenol Communications Solutions BergStak Series Straight Surface PCB Socket, 60-Contact, 2 Row, 0.8 mm Pitch Solder
- RS 제품 번호:
- 615-9372
- 제조사 부품 번호:
- 61082-061400LF
- 제조업체:
- Amphenol Communications Solutions
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대량 구매 할인 기용 가능
Subtotal (1 unit)*
₩4,485.00
재고있음
- 360 개 단위 배송 준비 완료
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수량 | 한팩당 |
|---|---|
| 1 - 3 | ₩4,485.00 |
| 4 - 7 | ₩4,387.50 |
| 8 + | ₩4,290.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 615-9372
- 제조사 부품 번호:
- 61082-061400LF
- 제조업체:
- Amphenol Communications Solutions
사양
참조 문서
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제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Amphenol Communications Solutions | |
| Product Type | PCB Socket | |
| Number of Contacts | 60 | |
| Sub Type | Board-to-Board | |
| Number of Rows | 2 | |
| Pitch | 0.8mm | |
| Current | 500mA | |
| Termination Type | Solder | |
| Housing Material | Glass Reinforced Liquid Crystal Polymer | |
| Mount Type | Surface | |
| Orientation | Straight | |
| Stacking Height | 20mm | |
| Connector System | Board-to-Board | |
| Voltage | 100V | |
| Series | BergStak | |
| Minimum Operating Temperature | -65°C | |
| Maximum Operating Temperature | 125°C | |
| Contact Plating | Gold | |
| Contact Gender | Female | |
| Contact Material | Beryllium Copper Alloy | |
| Standards/Approvals | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Amphenol Communications Solutions | ||
Product Type PCB Socket | ||
Number of Contacts 60 | ||
Sub Type Board-to-Board | ||
Number of Rows 2 | ||
Pitch 0.8mm | ||
Current 500mA | ||
Termination Type Solder | ||
Housing Material Glass Reinforced Liquid Crystal Polymer | ||
Mount Type Surface | ||
Orientation Straight | ||
Stacking Height 20mm | ||
Connector System Board-to-Board | ||
Voltage 100V | ||
Series BergStak | ||
Minimum Operating Temperature -65°C | ||
Maximum Operating Temperature 125°C | ||
Contact Plating Gold | ||
Contact Gender Female | ||
Contact Material Beryllium Copper Alloy | ||
Standards/Approvals No | ||
0.8mm Bergstak® Series
These FCI Bergstk® high density 0.8mm pitch SMT connectors provide space saving in board to board stacking applications.
Blade-on-beam contacts allow ’peeling’ and prevent ’stubbing’
The Bergstak® system from FCI are high density parallel board to board connectors which can be configured to various PCB stack heights. These Bergstak® connectors are polarized, have generous lead-in angles with precise contact positioning ensuring precise mating alignment and reliability.
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