Amphenol Socapex HDAS Series Straight PCB PCB Socket, 29-Contact, 3 Row, 1.905 mm Pitch Solder
- RS 제품 번호:
- 208-5022
- 제조사 부품 번호:
- HDASE029YD-000LF
- 제조업체:
- Amphenol Socapex
현재 비가용
RS는 이 제품을 더 이상 판매하지 않습니다.
- RS 제품 번호:
- 208-5022
- 제조사 부품 번호:
- HDASE029YD-000LF
- 제조업체:
- Amphenol Socapex
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Amphenol Socapex | |
| Product Type | PCB Socket | |
| Number of Contacts | 29 | |
| Number of Rows | 3 | |
| Sub Type | Board-to-Board | |
| Pitch | 1.905mm | |
| Current | 4.5A | |
| Termination Type | Solder | |
| Housing Material | Glass Filled Thermoplastic Liquid Crystal Polymer | |
| Mount Type | PCB | |
| Orientation | Straight | |
| Connector System | Board-to-Board | |
| Voltage | 750V | |
| Series | HDAS | |
| Row Pitch | 1.905mm | |
| Minimum Operating Temperature | -65°C | |
| Contact Plating | Gold | |
| Maximum Operating Temperature | 125°C | |
| Contact Material | Copper Alloy | |
| Contact Gender | Male/Female | |
| Standards/Approvals | No | |
| 모두 선택 | ||
|---|---|---|
브랜드 Amphenol Socapex | ||
Product Type PCB Socket | ||
Number of Contacts 29 | ||
Number of Rows 3 | ||
Sub Type Board-to-Board | ||
Pitch 1.905mm | ||
Current 4.5A | ||
Termination Type Solder | ||
Housing Material Glass Filled Thermoplastic Liquid Crystal Polymer | ||
Mount Type PCB | ||
Orientation Straight | ||
Connector System Board-to-Board | ||
Voltage 750V | ||
Series HDAS | ||
Row Pitch 1.905mm | ||
Minimum Operating Temperature -65°C | ||
Contact Plating Gold | ||
Maximum Operating Temperature 125°C | ||
Contact Material Copper Alloy | ||
Contact Gender Male/Female | ||
Standards/Approvals No | ||
- COO (Country of Origin):
- FR
The Amphenol HDAS receptacle 29 contact reduce the pitch and increases the density of contact with the brand new HDAS range with its robust and simple design, high density and high performance to extreme condition, HDAS is the right connector when installation, cost and reliability must be considered.
Dedicated to harsh environment
Press-fit technology for significant assembly cost reduction and extreme reliability
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