TE Connectivity AMPMODU Series Horizontal Cable Connector Assembly, 8-Contact, 1 Row, 2 mm Pitch Solder
- RS 제품 번호:
- 788-037
- 제조사 부품 번호:
- 2317222-8
- 제조업체:
- TE Connectivity
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Subtotal (1 tube of 168 units)*
₩797,100.00
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Tube(s) | Per Tube | 한팩당* |
|---|---|---|
| 1 + | ₩797,100.00 | ₩4,744.00 |
* 참고 가격: 실제 구매가격과 다를 수 있습니다
- RS 제품 번호:
- 788-037
- 제조사 부품 번호:
- 2317222-8
- 제조업체:
- TE Connectivity
사양
참조 문서
제정법과 컴플라이언스
제품 세부 사항
제품 정보를 선택해 유사 제품을 찾기
모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TE Connectivity | |
| Product Type | Connector Assembly | |
| Number of Contacts | 8 | |
| Number of Rows | 1 | |
| Sub Type | Socket | |
| Pitch | 2mm | |
| Current | 2A | |
| Termination Type | Solder | |
| Housing Material | Thermoplastic | |
| Mount Type | Cable | |
| Orientation | Horizontal | |
| Connector System | Wire-to-Board | |
| Series | AMPMODU | |
| Minimum Operating Temperature | -40°C | |
| Maximum Operating Temperature | 105°C | |
| 모두 선택 | ||
|---|---|---|
브랜드 TE Connectivity | ||
Product Type Connector Assembly | ||
Number of Contacts 8 | ||
Number of Rows 1 | ||
Sub Type Socket | ||
Pitch 2mm | ||
Current 2A | ||
Termination Type Solder | ||
Housing Material Thermoplastic | ||
Mount Type Cable | ||
Orientation Horizontal | ||
Connector System Wire-to-Board | ||
Series AMPMODU | ||
Minimum Operating Temperature -40°C | ||
Maximum Operating Temperature 105°C | ||
- COO (Country of Origin):
- CN
The TE Connectivity Wire to board IDC receptacle platform offers robust and space-efficient connections Ideal for today's miniature electronic applications. It enables reliable data transmission while significantly reducing the physical footprint compared to traditional connectors.
38% smaller than traditional 2.54 mm connectors
Secure connections in high vibration environments with positive latching options
Facilitates quick, tool-free termination without wire stripping
Cost-effective application using recommended manual or pneumatic tools
Interchangeable IDC and crimp contacts simplify maintenance
Compatible with standard headers for seamless integration
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