Molex 44764 Series Right Angle Through Hole Receptacle, 14-Contact, 2 Row, 3 mm Pitch Through Hole
- RS 제품 번호:
- 691-251
- 제조사 부품 번호:
- 44764-1401
- 제조업체:
- Molex
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- RS 제품 번호:
- 691-251
- 제조사 부품 번호:
- 44764-1401
- 제조업체:
- Molex
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Molex | |
| Number of Contacts | 14 | |
| Product Type | Receptacle | |
| Sub Type | PCB Receptacle | |
| Number of Rows | 2 | |
| Pitch | 3mm | |
| Current | 8.5A | |
| Termination Type | Through Hole | |
| Mount Type | Through Hole | |
| Orientation | Right Angle | |
| Connector System | Power | |
| Series | 44764 | |
| Minimum Operating Temperature | -40°C | |
| Row Pitch | 3mm | |
| Contact Material | Phosphor Bronze | |
| Maximum Operating Temperature | 105°C | |
| Contact Plating | Gold | |
| Standards/Approvals | REACH SVHC | |
| 모두 선택 | ||
|---|---|---|
브랜드 Molex | ||
Number of Contacts 14 | ||
Product Type Receptacle | ||
Sub Type PCB Receptacle | ||
Number of Rows 2 | ||
Pitch 3mm | ||
Current 8.5A | ||
Termination Type Through Hole | ||
Mount Type Through Hole | ||
Orientation Right Angle | ||
Connector System Power | ||
Series 44764 | ||
Minimum Operating Temperature -40°C | ||
Row Pitch 3mm | ||
Contact Material Phosphor Bronze | ||
Maximum Operating Temperature 105°C | ||
Contact Plating Gold | ||
Standards/Approvals REACH SVHC | ||
- COO (Country of Origin):
- US
The Molex Micro-Fit BMI Receptacle is ingeniously designed for high-density PCB interconnections, providing reliable electrical connections in a Compact format. This dual-row, right-angle receptacle integrates press-fit plastic pegs and a robust tin plating, ensuring both durability and optimal performance. Rated for a maximum of 600V and capable of handling up to 8.5A per contact, it caters to various applications, from board-to-board connections to power delivery. With a total of 14 circuits, this receptacle meets the needs of modern electronic devices while its low-halogen compliance aligns with environmental standards, making it an excellent choice for industries prioritizing sustainability.
Pressure-fit plastic pegs enhance installation stability
Compatible with multiple connectors and housings in the Micro-Fit BMI series
Easy integration with recommended PCB thickness of 1.60mm
Plated with 1.016μm tin for enhanced conductivity and protection
Max lead-free solder temperature of 260°C supports eco-friendly manufacturing processes
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