TE Connectivity AMPMODU System 50 Series Straight Surface Mount PCB Header, 40 Contact(s), 1.27mm Pitch, 2 Row(s),
- RS 제품 번호:
- 745-4915
- 제조사 부품 번호:
- 5-104549-6
- 제조업체:
- TE Connectivity
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- RS 제품 번호:
- 745-4915
- 제조사 부품 번호:
- 5-104549-6
- 제조업체:
- TE Connectivity
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | TE Connectivity | |
| Series | AMPMODU System 50 | |
| Pitch | 1.27mm | |
| Number of Contacts | 40 | |
| Number of Rows | 2 | |
| Body Orientation | Straight | |
| Shrouded/Unshrouded | Shrouded | |
| Connector System | Board to Board, Wire to Board | |
| Mounting Type | Surface Mount | |
| Termination Method | Solder | |
| Contact Material | Copper Alloy | |
| Contact Plating | Gold | |
| Current Rating | 1.0A | |
| Voltage Rating | 30 V ac | |
| 모두 선택 | ||
|---|---|---|
브랜드 TE Connectivity | ||
Series AMPMODU System 50 | ||
Pitch 1.27mm | ||
Number of Contacts 40 | ||
Number of Rows 2 | ||
Body Orientation Straight | ||
Shrouded/Unshrouded Shrouded | ||
Connector System Board to Board, Wire to Board | ||
Mounting Type Surface Mount | ||
Termination Method Solder | ||
Contact Material Copper Alloy | ||
Contact Plating Gold | ||
Current Rating 1.0A | ||
Voltage Rating 30 V ac | ||
TE Connectivity 1.27mm x 2.54mm AMPMODU System 50 Board to Board Headers
AMPMODU System 50 1.27 x 2.54mm shrouded and unshrouded board to board PCB header connectors with a high density design for PCB space saving. The housings of these AMPMODU System 50 1.27 x 2.54mm headers are made from high termperature thermoplastic with a polarized design to aid alignment to mating connectors and stand-offs for drainage. The unshrouded versions of these AMPMODU System 50 headers allow for the close stacking of daughter cards. These AMPMODU System 50 1.27 x 2.54mm board to board headers are available in a variety of configurations, single row, double row, vertical, right angle, through hole and SMT
Part numbers x-104074-x and x-104069-x have solder clips / PCB hold down posts.
TE Connectivity AMPMODU System 50 Interconnection System
AMPMODU System 50 Interconnection System with a compact space saving design and high density 1.27 x 2.54 mm contact spacing for use in high density applications. The AMPMODU System 50 connector system consists of PCB headers, PCB receptacles and wire to board IDC ribbon cable connectors. These connectors are available in various configurations making the AMPMODU System 50 connector system suitable for a wide range of applications. The contacts of the AMPMODU System 50 connectors are made from high conductivity copper alloy with selective gold plating for high electrical performance and reliability.
관련된 링크들
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- TE Connectivity AMPMODU System 50 Series Straight Surface PCB Header, 40 Contact(s), 1.27 mm Pitch, 2 Row, Shrouded
- TE Connectivity AMPMODU Series Vertical PCB Mount PCB Header, 2 Contact(s), 2.54mm Pitch, 1 Row(s), Shrouded
- TE Connectivity AMPMODU Series Right Angle Through Hole PCB Header, 16 Contact(s), 2.54mm Pitch, 2 Row(s)
- TE Connectivity AMPMODU Series Vertical Board Mount PCB Header, 7 Contact(s), 2.54mm Pitch, 1 Row(s), Shrouded
- TE Connectivity AMPMODU Series Right Angle Through Hole PCB Header, 12 Contact(s), 2.54mm Pitch, 2 Row(s)
- TE Connectivity AMPMODU Series Vertical Board Mount PCB Header, 16 Contact(s), 2.54mm Pitch, 1 Row(s), Shrouded
