Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 6 Contact(s), 3 mm Pitch, 2 Row, Shrouded

RS 제품 번호:: 670-1932
제조사 부품 번호:: 43045-0610
제조업체:: Molex

Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 6 Contact(s), 3 mm Pitch, 2 Row, Shrouded

본 이미지는 참조용이오니 재확인이 필요하시면 문의해주세요.

대량 구매 할인 기용 가능

Subtotal (1 pack of 5 units)*

₩21,168.80

재고있음

5 개 단위 배송 준비 완료

더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.

수량	한팩당	한팩당*
5 - 445	₩4,233.76	₩21,168.80
450 - 895	₩4,139.76	₩20,698.80
900 +	₩4,053.28	₩20,266.40

* 참고 가격: 실제 구매가격과 다를 수 있습니다

RS 제품 번호:: 670-1932
제조사 부품 번호:: 43045-0610
제조업체:: Molex

참조 문서

제정법과 컴플라이언스

제품 세부 사항

제품 정보를 선택해 유사 제품을 찾기

모두 선택	제품 정보	값
	브랜드	Molex
	Series	Micro-Fit 3.0
	Product Type	PCB Header
	Current	5A
	Pitch	3mm
	Number of Contacts	6
	Housing Material	Thermoplastic
	Number of Rows	2
	Orientation	Right Angle
	Shrouded/Unshrouded	Shrouded
	Connector System	Wire-to-Board
	Mount Type	Surface
	Contact Plating	Gold
	Contact Material	Brass
	Termination Type	Solder
	Row Pitch	3mm
	Minimum Operating Temperature	-40°C
	Maximum Operating Temperature	125°C
	Contact Gender	Male
	Mating Pin Length	3mm
	Standards/Approvals	No
	Voltage	250 V
	Distrelec Product Id	304-33-531

	모두 선택
	브랜드 Molex
	Series Micro-Fit 3.0
	Product Type PCB Header
	Current 5A
	Pitch 3mm
	Number of Contacts 6
	Housing Material Thermoplastic
	Number of Rows 2
	Orientation Right Angle
	Shrouded/Unshrouded Shrouded
	Connector System Wire-to-Board
	Mount Type Surface
	Contact Plating Gold
	Contact Material Brass
	Termination Type Solder
	Row Pitch 3mm
	Minimum Operating Temperature -40°C
	Maximum Operating Temperature 125°C
	Contact Gender Male
	Mating Pin Length 3mm
	Standards/Approvals No
	Voltage 250 V
	Distrelec Product Id 304-33-531

Molex 43045 Series PCB Header, 3mm Pitch, 8.5A Current Rating - 43045-0610

This PCB header belongs to the Micro-Fit 3.0™ family of Molex products, designed specifically for high-performance applications. Featuring dual rows and a right-angle orientation, it supports surface mount installation and offers 6 circuits for robust connectivity. The product is shrouded for added safety and comes with solder termination methods, making it ideal for wire-to-board applications.

Features & Benefits

• High current handling of 8.5A enhances reliability in demanding applications.

• Glow wire compatibility ensures safety in high-temperature environments.

• 0.38μm gold selective plating improves corrosion resistance.

• Durable design supports up to 30 mating cycles for extended use.

• Compact 3.0mm pitch enables space-saving layouts in electronic designs.

• PCB retention features provide secure positioning on printed circuit boards.

Applications

• Used for power distribution in electronic devices.

• Ideal for connections in automation and control systems.

• Utilised in consumer electronics requiring space-efficient layouts.

• Applied in electrical machinery for reliable power transfer.

• Suitable for use in high-temperature environments due to flammability compliance.

What makes this product suitable for high-temperature environments?

The material used has a glow wire ignition temperature of at least 775°C and a flammability index above 850°C, ensuring it meets safety standards for heat and fire resistance.

How does the shrouded design enhance usability?

The shrouded design protects the contacts from contamination and physical damage during installation and operation, ensuring better connection reliability over time.

What is the recommended PCB thickness for optimal performance?

The recommended PCB thickness for this header is 1.60mm, which ensures proper fit and performance during soldering and operation.

How does the product maintain secure connections within the board?

The PCB retention feature guarantees that the header is firmly held in place, preventing disconnection due to vibrations or mechanical stress during operation.

What types of applications benefit from using solder termination?

Solder termination connectors provide a permanent electrical connection, making them ideal for applications that require robust and reliable joint integrity in high-stress environments.