Molex Micro-Fit 3.0 Series Right Angle Through Hole PCB Header, 20 Contact(s), 3 mm Pitch, 2 Row, Shrouded

본 이미지는 참조용이오니 재확인이 필요하시면 문의해주세요.

대량 구매 할인 기용 가능

Subtotal (1 pack of 5 units)*

₩36,754.00

Add to Basket
수량 선택 또는 입력
재고있음
  • 추가로 2025년 12월 29일 부터 160 개 단위 배송
더 자세한 내용이 필요하신가요? 필요한 수량을 입력하고 '배송일 확인'을 클릭하면 더 많은 재고 및 배송 세부정보를 확인하실 수 있습니다.
수량
한팩당
한팩당*
5 - 20₩7,350.80₩36,754.00
25 +₩7,264.32₩36,321.60

* 참고 가격: 실제 구매가격과 다를 수 있습니다

포장 옵션
RS 제품 번호:
670-0554
제조사 부품 번호:
43045-2022
제조업체:
Molex
제품 정보를 선택해 유사 제품을 찾기
모두 선택

브랜드

Molex

Product Type

PCB Header

Series

Micro-Fit 3.0

Current

5A

Pitch

3mm

Housing Material

High Temperature Thermoplastic

Number of Contacts

20

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Mount Type

Through Hole

Connector System

Wire-to-Board

Contact Plating

Gold

Contact Material

Brass

Row Pitch

3mm

Termination Type

Solder

Minimum Operating Temperature

-40°C

Maximum Operating Temperature

125°C

Contact Gender

Male

Standards/Approvals

No

Mating Pin Length

3mm

Voltage

250 V

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Metal Press Fit Retention Clips, 43045 Series


Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Press fit retention clips for PCB retention

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


관련된 링크들