Molex Micro-Fit 3.0 Series Right Angle Surface PCB Header, 12 Contact(s), 3 mm Pitch, 2 Row, Shrouded

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Subtotal (1 pack of 5 units)*

₩29,422.00

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  • 2026년 4월 28일 부터 배송
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한팩당
한팩당*
5 - 95₩5,884.40₩29,422.00
100 - 370₩5,707.68₩28,538.40
375 - 1495₩5,530.96₩27,654.80
1500 - 2995₩5,429.44₩27,147.20
3000 +₩5,275.28₩26,376.40

* 참고 가격: 실제 구매가격과 다를 수 있습니다

포장 옵션
RS 제품 번호:
670-2005
제조사 부품 번호:
43045-1207
제조업체:
Molex
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브랜드

Molex

Series

Micro-Fit 3.0

Product Type

PCB Header

Current

5A

Pitch

3mm

Number of Contacts

12

Housing Material

High Temperature Thermoplastic

Number of Rows

2

Orientation

Right Angle

Shrouded/Unshrouded

Shrouded

Connector System

Wire-to-Board

Mount Type

Surface

Contact Plating

Gold

Contact Material

Brass

Minimum Operating Temperature

-40°C

Termination Type

Solder

Row Pitch

3mm

Contact Gender

Male

Maximum Operating Temperature

125°C

Mating Pin Length

3mm

Standards/Approvals

No

Voltage

250 V

COO (Country of Origin):
MX

Molex Micro-Fit 3.0 3.0mm Dual Row PCB Headers with Metal Press Fit Retention Clips, 43045 Series


Micro-Fit 3.0 3mm pitch wire to board dual row PCB through hole and SMT headers which form part of a Compact power connector system providing a low to mid-range power distribution solution. With the Ability to carry up to 5A of current, Micro-Fit 3.0 connectors have one of the highest current carrying abilities in the smallest footprints available. These Micro-Fit 3.0 PCB headers incorporate positive latching in the form of a locking ramp on the housing for secure mating and to prevent accidental disconnection. The housings are MADE of high-temperature UL 94V-0 Liquid Crystal Polymer that can withstand temperatures of up to 265°C during the IR reflow soldering process. The through hole mounting versions of these Micro-Fit 3.0 headers are also SMT compatible which means a reduction in process requirements and costs. To secure these Micro-Fit 3.0 headers to the PCB board, metal press-fit retention clips are incorporated into the connector design. The contacts of these Micro-Fit 3.0 headers are fully isolated within the housings to reduce arcing. Tin or a choice of two thicknesses of gold contact platings are available to keep down costs.

Features and Benefits


• High current carrying capacity in a small footprint

• High temperature housings for IR reflow soldering

• Through hole versions SMT compatible

• Positive latching for secure mating connection

• Fully isolated dual beam terminals for reliable electrical performance and contact

• Press fit retention clips for PCB retention

• Glow Wire Compliant

Product Application Information


These Micro-Fit 3.0 header connectors are suitable for use in a wide range of low to mid power applications including the following:

Military COTS (Commercial Off The Shelf)

Solar power

Consumer products (dryers, freezers, fridges, washing machines)

Data communications (routers, servers)

Medical

Telecommunications

Gaming terminals

Molex Micro-Fit 3.0 Series


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