Amphenol Communications Solutions Bergstik Series Straight Surface Pin Header, 6 Contact(s), 2.54 mm Pitch, 1 Row,
- RS 제품 번호:
- 236-4720
- 제조사 부품 번호:
- 95293-101A06LF
- 제조업체:
- Amphenol Communications Solutions
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- RS 제품 번호:
- 236-4720
- 제조사 부품 번호:
- 95293-101A06LF
- 제조업체:
- Amphenol Communications Solutions
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모두 선택 | 제품 정보 | 값 |
|---|---|---|
| 브랜드 | Amphenol Communications Solutions | |
| Series | Bergstik | |
| Product Type | Pin Header | |
| Current | 3A | |
| Pitch | 2.54mm | |
| Number of Contacts | 6 | |
| Housing Material | High Temperature Thermoplastic | |
| Number of Rows | 1 | |
| Orientation | Straight | |
| Shrouded/Unshrouded | Unshrouded | |
| Mount Type | Surface | |
| Connector System | Board-to-Board | |
| Contact Material | Phosphor Bronze | |
| Contact Plating | Gold or Tin over Nickel | |
| Minimum Operating Temperature | -65°C | |
| Termination Type | Solder | |
| Row Pitch | 2.54mm | |
| Maximum Operating Temperature | 125°C | |
| Contact Gender | Male | |
| Standards/Approvals | CSA, LR, RoHS, UL94V-0 | |
| Voltage | 1500 Vrms | |
| 모두 선택 | ||
|---|---|---|
브랜드 Amphenol Communications Solutions | ||
Series Bergstik | ||
Product Type Pin Header | ||
Current 3A | ||
Pitch 2.54mm | ||
Number of Contacts 6 | ||
Housing Material High Temperature Thermoplastic | ||
Number of Rows 1 | ||
Orientation Straight | ||
Shrouded/Unshrouded Unshrouded | ||
Mount Type Surface | ||
Connector System Board-to-Board | ||
Contact Material Phosphor Bronze | ||
Contact Plating Gold or Tin over Nickel | ||
Minimum Operating Temperature -65°C | ||
Termination Type Solder | ||
Row Pitch 2.54mm | ||
Maximum Operating Temperature 125°C | ||
Contact Gender Male | ||
Standards/Approvals CSA, LR, RoHS, UL94V-0 | ||
Voltage 1500 Vrms | ||
- COO (Country of Origin):
- FR
The Amphenol ICC BergStik unshrouded header has 2.54 mm pitch provide board-to-board, wire-to-board and cable-to-board interconnect solutions for all types of electronic equipment and devices.
High temperature thermoplastic material
Reflow compatible
Variable spacing height for stacking headers
Cater to a wide range of applications
Allow dual entry, mating from top or bottom
Suitable for mezzanine application and gives more flexibility in meeting different stack height requirements
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